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Wire bonding device

A wire bonding device and bonding tool technology, which can be used in welding equipment, fluids utilizing vibration, semiconductor/solid-state device components, etc., and can solve the problems of electrode and wire peeling of semiconductor bare chips.

Pending Publication Date: 2021-02-19
SHINKAWA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the bonding wire stretched between the electrode and the lead wire resonates due to the ultrasonic vibration when the bonding wire is connected to the lead wire, and there is a problem that the junction between the electrode and the bonding wire of the semiconductor die is peeled off.

Method used

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Embodiment Construction

[0044]

[0045]Hereinafter,Figure one The wiring engagement device 100 of the embodiment will be described. Such asfigure 1 As shown, the wire bonding device 100 of this embodiment includes: a frame 10; an XY table 11 installed on the frame 10; a joint head 12 installed on the XY table 11; a joint arm 13 installed on the joint head 12; The ultrasonic welding head 14 is installed at the front end of the bonding arm 13; the ultrasonic vibrator 16 makes the ultrasonic welding head 14 ultrasonically vibrated; the welding needle 15 is a bonding tool installed at the front end of the ultrasonic welding head 14; the heating block 17 is installed on the The lead frame 20 of the semiconductor die 19 is heated and sucked; and the control unit 50. Furthermore, infigure 1 Among them, the XY direction represents the horizontal direction, and the Z direction represents the vertical direction.

[0046]The bonding head 12 is moved in the XY direction by the XY table 11. A Z-direction motor 30 that drives...

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Abstract

The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a tip-mounted capillary (15) with different frequencies in the Y-direction and X-direction; and a control unit (50) which adjusts the respective amplitudes of the two ultrasonic vibrations, wherein the Y-direction is the direction in which the ultrasonic horn (14) extends. The controlunit (50) adjusts the respective amplitudes of the two ultrasonic vibrations to adjust the amplitude ratio (delta Y / delta X) of the vibrations of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joints of wires and leads is suppressed.

Description

Technical field[0001]The present invention relates to a configuration of a wire bonding device.Background technique[0002]The wiring bonding means connected between the electrodes of the semiconductor die (DIE) and the lead frame (the lead frame) of the lead frame (the lead frame) is widely used. The wiring bonding means is to vibrate the solder needle in a state in which the wire is pressed against the electrode by the solder needle, and after the wire is joined to the electrodes, the wiring holders is set to the lead, and the frame will be The wire is pressed in the state of the lead, allowing the solder needle to vibrate, and the means for connecting the wiring and leads (for example, refer to Patent Document 1).[0003]In the wiring bonding apparatus described in Patent Document 1, the direction of the ultrasonic vibration of the solder needle is the extension direction (Y direction) of the ultrasonic weld head. On the other hand, the lead is radially disposed around the semiconduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L2224/85045B06B3/00B06B1/0614B23K20/10B23K20/005H01L2924/00014H01L2224/49171H01L2224/48465H01L2224/48247H01L2224/85181H01L2224/78318H01L2224/48091H01L24/78H01L2224/85206H01L24/85H01L2224/05554H01L2224/78901H01L2224/78353H01L2224/78301H01L24/48H01L24/49H01L24/05H01L2224/78349H01L2224/45099H01L24/46H01L23/495B23K20/106B23K20/004H01L2224/78B23K2101/40B06B1/0276B06B1/0622B06B2201/72H01L2224/78355H01L2224/78925
Inventor 青柳伸幸雨宫茂
Owner SHINKAWA CO LTD
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