Automatic film pasting equipment for surface of semiconductor wafer

Abstract

The invention relates to the technical field of wafer processing equipment, in particular to automatic film pasting equipment for the surface of a semiconductor wafer, which can effectively save the physical strength and time during manual film pasting operation and improve the film pasting work efficiency by performing automatic film pasting treatment on a semiconductor wafer; meanwhile, the bubble removal effect between a film and the wafer is improved, the bubble residuals are avoided, and the effect is effectively improved. According to the wafer protection device, the stress intensity ofthe wafer is monitored in real time, so that the wafer can be conveniently protected, the wafer is prevented from being extruded and damaged, and the practicability and reliability are improved; the equipment comprises a base, a circular adsorption bin, a rubber pad and a first arc-shaped plate; a transverse pushing device is arranged at the top of the base, a pressure detection device is arrangedon the left side of the transverse pushing device, the circular adsorption bin is installed on the pressure detection device, and the rubber pad is installed at the top of the circular adsorption bin; multiple groups of conical holes are uniformly formed in the outer side of the top of the rubber pad; and the bottoms of the multiple sets of conical holes communicate with the interior of the circular adsorption bin.

Description

technical field [0001] The invention relates to the technical field of wafer processing equipment, in particular to automatic film sticking equipment on the surface of semiconductor wafers. Background technique [0002] As we all know, the wafer is the basic raw material for making semiconductor electrical components. It is mainly cut from silicon rods. When the wafer is processed and produced, it usually needs to be treated with a film on its surface to protect the surface of the wafer. The existing wafer The method of round film sticking is mainly to manually stick the film on the surface of the wafer, and then use the roller to squeeze out the air bubbles between the film and the surface of the wafer, so that the vacuum state between the film and the surface of the wafer is achieved, and the film is automatically It is adsorbed on the surface of the wafer, and then the excess film on the wafer is manually cut off to achieve the purpose of wafer film attachment. However, w...

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Problems solved by technology

[0002] As we all know, the wafer is the basic raw material for making semiconductor electrical components. It is mainly cut from silicon rods. When the wafer is processed and produced, it usually needs to be treated with a film on its surface to protect the surface of the wafer. The existing wafer The method of round film sticking is mainly to manually stick the film on the surface of the wafer, and then use the roller to squeeze out the air bubbles between the film and the surface of the wafer, so that the vacuum state between the film and the surface of the wafer is achieved, and the film is automatically It is adsorbed on the surface of the wafer, and then the excess film on the wafer is manually cut off to achieve the purpose of wafer film attachment. However, when this method is used, the effect of the roller on the air bubbles between the film and the wafer is poor, and it is easy to This results in tiny air bubbles remaining, resulting in a poor film attachment effect. Due to the low hardness of the wafer, it is easy to cause damage to the wafer when the roller is squeezed. At the same time, this film attachment method requires manual operation, the film attachment speed is slow, and the work efficiency is low. Need to consume excess manpower

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