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IC layout tiles with internal channel for signal distribution

A signal distribution and signal technology, applied in the direction of generating/distributing signals, logic circuit connection/interface layout, electrical components, etc., can solve problems such as complex integrated circuit equipment

Pending Publication Date: 2021-02-23
CREDO TECH GRP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0001] Most integrated circuit devices have become so complex that it is impractical for electronic device designers to design integrated circuit devices from scratch

Method used

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  • IC layout tiles with internal channel for signal distribution
  • IC layout tiles with internal channel for signal distribution
  • IC layout tiles with internal channel for signal distribution

Examples

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Embodiment Construction

[0016] While specific embodiments are given in the drawings and the following description, it is noted that they do not limit the disclosure. On the contrary, they provide a basis for those skilled in the art to discern alternatives, equivalents and modifications included within the scope of the appended claims.

[0017] Figure 1A Shown is a plan view of a semiconductor wafer 100 that is patterned to form an array of integrated circuits 102 that may be singulated into IC chips and packaged as components for assembly in an electronic device. IC chips can be packaged individually or combined into multi-chip modules using interposers and / or packaging substrates, in either case ball grid arrays or lead frames are used to provide external contacts so that typically Electrically connect with other circuit components via the printed circuit board. Each IC chip can implement digital logic, analog functions, and / or mixed-signal circuits.

[0018] Patterning of wafers is performed by...

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Abstract

Modular layout design units are provided with an internal channel for multi-directional distribution of a shared signal. In one illustrative embodiment, an integrated circuit includes: one or more modular units, each modular unit having an internal channel for signal distribution. The internal channel possesses: an edge connection on each edge of the modular unit; a hub node coupled to each edge connection by a respective bi-directional buffer having an incoming buffer and an outgoing buffer with at least one of the incoming and outgoing buffers disabled, the bi-directional buffers cooperatingto steer a signal from a selectable one of the edge connections to one or more of the other edge connections; and a tap providing the signal for use by internal circuitry of the modular unit.

Description

Background technique [0001] Most integrated circuit devices have become so complex that it is impractical for an electronic device designer to design an integrated circuit device from scratch. Instead, electronic device designers rely on pre-defined modular units of integrated circuit layout designs, arranging and joining them as necessary to achieve the various functions of the desired device. Each modular unit has a defined interface and behavior verified by its creator. Although each modular unit may require significant time and investment to create, its re-use and availability for further development greatly reduces product cycle times and makes products better. The predefined units may be organized hierarchically, with a given unit containing one or more lower-level units and subsumed within higher-level units. Many organizations have libraries of such pre-defined modular units for sale or licensing, including, for example: embedded processors, memories, interfaces for ...

Claims

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Application Information

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IPC IPC(8): H01L27/02
CPCH01L27/0207H03K19/017509G06F1/10
Inventor J·舍瑞迪L·C·F·程
Owner CREDO TECH GRP LTD
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