Anti-collision detection system for chemical mechanical polishing equipment

Abstract

The invention belongs to the technical field of chemical mechanical grinding equipment, in particular to an anti-collision detection system for chemical mechanical grinding equipment, comprising a support unit and a grinding unit; the support unit includes a rotating shaft, a turntable and a grinding pad; a grinding unit on one side of the support unit; The unit includes a rotating rod, a cross rod, a motor and a grinding head; a cylindrical base plate is arranged between the motor and the grinding head; a gap is left between the lower end face of the base plate and the upper end face of the grinding head, and a distance is set on the outer ring of the base plate Sensor: A distance sensor is placed next to the grinding head to detect the distance between the adjuster for the grinding pad and the grinding head in real time. Once the detection distance of the distance sensor is less than the safety distance set by the user, the dangerous distance information will be transmitted to the control computer, and the control computer will The signal is fed back to the driver of the polishing pad regulator, the motor stops working, an alarm is given and the metal chips on the polishing pad are repaired and cleaned.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical grinding equipment, in particular to an anti-collision detection system for chemical mechanical grinding equipment. Background technique [0002] In chemical mechanical polishing, in wafer manufacturing, with the upgrading of process technology and the reduction of wire and gate size, lithography technology has higher and higher requirements for the flatness of the wafer surface (Non-uniformity). IBM Corporation in 1985 In 1990, CMOS products were introduced and successfully applied in 64MB DRAM production. After 1995, CMP technology has developed rapidly and has been widely used in the semiconductor industry. Chemical mechanical polishing is also known as chemical mechanical polishing. Its principle is a processing technology that combines chemical corrosion and mechanical removal. It is the only technology in mechanical processing that can achieve global flattening of the surface. ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the chemical mechanical polishing equipment needs the adjuster arm of the polishing pad to swing back and forth during the grinding process, and the grinding head is also swinging at the same time. The grinding head of the polishing pad regulator is fixed on the equipment base by multiple screws, and after the chemical mechanical polishing equipment has been running for a long time, the front end of the polishing pad regulator may collide with the outer wall of the grinding head, and the result is If the position between the adjuster for the polishing pad and the grinding head is not found and corrected in time, the metal debris generated by the collision between the front end of the adjuster for the polishing pad and the outer wall of the grinding head will directly fall on the surface of the polishing pad and damage the surface of the processed wafer. To cause fatal damage, a distance sensor is placed beside the grinding head to detect the distance between the regulator for the polishing pad and the grinding head in real time

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