Anti-collision detection system for chemical mechanical grinding equipment

A chemical-mechanical, anti-collision technology, used in grinding/polishing equipment, grinding machine tools, grinding devices, etc., can solve the problems of collision, wafer surface damage, metal debris falling, etc., to avoid fatal damage, Enhanced stability and reduced friction

Active Publication Date: 2021-02-26
吉姆西半导体科技(无锡)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the chemical mechanical polishing equipment needs the adjuster arm of the polishing pad to swing back and forth during the grinding process, and the grinding head is also swinging at the same time. The grinding head of the polishing pad regulator is fixed on the equipment base by multiple screws, and after the chemical mechanical polishing equipment has been running for a long time, the front end of the polishing pad regulator may collide with the outer wall of the grinding head, and the result is If the position between the adjuster for the polishing pad and the grinding head is not found and corrected in time, the metal debris generated by the collision between the front end of the adjuster for the polishing pad and the outer wall of the grinding head will directly fall on the surface of the polishing pad and damage the surface of the processed wafer. To cause fatal damage, a distance sensor is placed beside the grinding head to detect the distance between the regulator for the polishing pad and the grinding head in real time

Method used

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  • Anti-collision detection system for chemical mechanical grinding equipment
  • Anti-collision detection system for chemical mechanical grinding equipment
  • Anti-collision detection system for chemical mechanical grinding equipment

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Experimental program
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Embodiment approach

[0033] As a specific embodiment of the present invention, an annular groove 27 is opened on the outer ring side wall of the base plate 25, and a plurality of connecting plates 271 are arranged in the annular groove 27; the section surface of each connecting plate 271 is in the shape of the letter " T "shape, the vertical two ends of each connecting plate 271 are embedded in the annular groove 27, the distance sensor 26 is affixed on the horizontal end of each connecting plate 271, and the polishing pad that the emission end of distance sensor 26 points to the outside is used for adjusting device;

[0034]The chemical mechanical polishing equipment needs the adjusting arm of the polishing pad to swing back and forth during the grinding, and the grinding head 24 is also doing the swinging action at the same time. The grinding head 24 with the regulator is fixed on the base of the equipment by multiple screws, and after the chemical mechanical grinding equipment has been running ...

specific Embodiment approach

[0038] As a specific embodiment of the present invention, the other end of the support rod 221 is provided with a groove, and a ball 223 is arranged in the groove; the ball 223 is rollingly connected in the groove, and the ball 223 is rollingly connected in the slide rail 222 The swing of the crossbar 22 is supported by the support rod 221, the stability of the horizontal movement of the crossbar 22 is enhanced, and the quality of the motor 23 and the grinding head 24 is prevented from pressing down on the other end of the crossbar 22, causing the crossbar 22 to tilt, which affects the grinding The horizontal accuracy of the grinding end of the head 24, and the rolling connection of the ball 223 installed at the other end of the support rod 221 in the slide rail 222 reduces the friction between the support rod 221 and the slide rail 222, so that the support rod 221 supports the cross bar 22 stably Swing, reduce the impact on distance sensor 26 detection distance work.

[0039]...

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PUM

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Abstract

The invention belongs to the technical field of chemical mechanical grinding equipment, and particularly relates to an anti-collision detection system for chemical mechanical grinding equipment. The system comprises a supporting unit and a grinding unit; the supporting unit comprises a rotating shaft, a turntable and a grinding pad; the grinding unit is arranged on one side of the supporting unit;the grinding unit comprises a rotating rod, a cross rod, a motor and a grinding head; a cylindrical base plate is arranged between the motor and the grinding head; a gap is reserved between the lowerend face of the base plate and the upper end face of the grinding head, and a distance sensor is arranged on the outer ring of the base plate; the distance sensor is arranged beside the grinding head, the distance between an adjuster for a grinding pad and the grinding head is detected in real time, once the distance detected by the distance sensor is smaller than the safety distance set by a user, dangerous distance information is transmitted to a control computer, the control computer feeds signals back to a driver of the adjuster for the grinding pad, the motor stops working, an alarm is given, and metal chippings on the grinding pad are overhauled and cleaned.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical grinding equipment, in particular to an anti-collision detection system for chemical mechanical grinding equipment. Background technique [0002] Chemical mechanical polishing, in wafer manufacturing, with the upgrading of process technology and the reduction of wire and gate size, photolithography technology has higher and higher requirements for the flatness of wafer surface (Non-uniformity). IBM Corporation in 1985 In 1990, CMOS products were introduced and successfully applied to the production of 64MB DRAM. After 1995, CMP technology developed rapidly and was widely used in the semiconductor industry. Chemical mechanical polishing is also called chemical mechanical polishing. Its principle is a processing technology that combines chemical corrosion and mechanical removal. It is the only technology that can achieve global surface planarization in mechanical processing. [0003] I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/005B24B37/04B24B37/34B24B49/04
CPCB24B37/005B24B37/04B24B37/34B24B49/04
Inventor 李峰刘玉龙
Owner 吉姆西半导体科技(无锡)有限公司
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