Temporary storage table device suitable for bonding 12-inch semiconductor crystal bar

Abstract

The invention discloses a temporary storage table device suitable for bonding 12-inch semiconductor crystal bar. The temporary storage table device comprises a workbench, four supporting legs are fixedly installed at the four corners of the bottom of the workbench, universal wheels are rotatably installed at the bottoms of the supporting legs, side plates and rear plates are correspondingly and fixedly installed between the supporting legs, hinges are correspondingly and fixedly installed on the same side faces of the two supporting legs, two door plates are rotationally installed on the end parts, away from the supporting legs, of the hinges, and handles are correspondingly and fixedly installed on one sides of the door plates. A rear baffle is fixedly installed on one side of the top ofthe workbench, a plurality of antenna supports are fixedly installed on one side of the rear baffle, a plurality of crystal bar bonding temporary storage assemblies are arranged on the sides, away from the rear baffle, of the antenna supports, and RFID reading devices are fixedly installed on the tops of the sides, close to the antenna supports, of the crystal bar bonding temporary storage assemblies. A material separation frame is fixedly installed between the crystal bar bonding temporary storage assemblies, and a work indicating lamp is fixedly arranged on the side, away from the rear baffle, of the material separation frame.

Description

technical field [0001] The invention relates to the technical field of semiconductor polishing sheet manufacturing, in particular to a buffer table device suitable for bonding 12-inch semiconductor crystal rods. Background technique [0002] In the field of semiconductor silicon polishing wafer manufacturing, the rod sticking process (bonding the wire-cut material holder and the crystal rod together) is a very important part of the entire processing process. In this process, the most important part is the control of the pre-curing time. If the curing time is insufficient, the ingot is likely to be separated from the material holder during the wire cutting process, causing quality and machine failures. If the curing time is too long, it will affect the production efficiency. At present, operators in the sticking process use conventional tables for pre-curing and buffering, and manually move materials in and out of the table. The entire process is manually carried, which pose...

AI Technical Summary

Problems solved by technology

In this process, the most important part is the control of the pre-curing time. If the curing time is insufficient, the ingot is easy to separate from the material holder during the wire cutting process, resulting in quality and machine accidents.

If the curing time is too long, it will affect the production efficiency

At present, the operators of the sticking process use conventional tables for pre-curing and buffering, and manually move materials in and out of the table. The entire process is manually carried, and there are extremely high material and safety risks.

The record of curing time is also manually recorded, which is prone to human errors. Therefore, we propose a 12-inch semiconductor ingot bonding buffer table device to solve the above problems

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