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Calculation method and calculation equipment for the number of wafers cut into wafers

A calculation method and wafer number technology, applied in computing, optomechanical equipment, microlithography exposure equipment, etc., can solve problems such as inaccurate data, long time consumption, and deviation of the maximum number of wafers

Active Publication Date: 2022-04-08
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the number X of effective chips on the wafer is often obtained by the following formula, namely However, the data calculated by this formula is not accurate, and there is a deviation from the maximum number of wafers that the wafer can actually cut
There are also stepping algorithms to calculate the data of effective wafers on the wafer, but the calculation process is complicated and time-consuming

Method used

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  • Calculation method and calculation equipment for the number of wafers cut into wafers
  • Calculation method and calculation equipment for the number of wafers cut into wafers
  • Calculation method and calculation equipment for the number of wafers cut into wafers

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Embodiment Construction

[0043] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0045] like ...

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Abstract

This application relates to a method for calculating the number of wafers cut from a wafer and its calculation equipment. The calculation method includes: establishing a two-dimensional coordinate system and determining the distribution array of wafers; Move the wafer center within and determine each first coverage area of ​​the wafer, calculate the number of effective wafers in each first coverage area and take the wafer center with the largest number of effective wafers as a feasible position; Feasible position at place, form feasible region; Move wafer center in feasible region according to the smaller second step value and determine each second coverage area of ​​wafer, calculate the effective number of wafers of each second coverage area, with the maximum The effective number of wafers is used as the optimal number of cut wafers. Through the idea of ​​heuristic algorithm, quickly determine the feasible area, narrow the search range, and then search precisely in the feasible area to determine the maximum number of wafers, thereby shortening the calculation time.

Description

technical field [0001] The invention relates to the field of semiconductor cutting technology, in particular to a method for calculating the number of wafers cut from a wafer and a calculation device thereof. Background technique [0002] Before processing the wafer, it is necessary to determine the cutting pattern of the wafer and the number of effective dies that can be cut. After processing, each die can be cut into a single chip. In order to save cost and increase output, it is necessary to rationally design the cutting pattern of the wafer to obtain the maximum effective number of wafers. At present, the number X of effective chips on the wafer is often obtained by the following formula, namely However, the data calculated by this formula is not accurate, and there is a deviation from the maximum number of wafers that the wafer can actually cut. There are also stepping algorithms to calculate the data of effective wafers on the wafer, but the calculation process is c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/11G06T7/12G03F7/20
CPCG06T7/11G06T7/12G03F7/70425G06T2207/30108G06T2207/30242
Inventor 萧礼明
Owner CHANGXIN MEMORY TECH INC