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TWS earphone

A technology for earphones and circuit boards, applied in earphone/earphone accessories, earphone manufacturing/assembly, electrical components, etc., can solve problems such as damage to electronic components, decline in product yield, and unfavorable reliability of TWS earphones, and improve product quality. Production yield and product quality stability, avoid damage caused by high temperature radiation

Active Publication Date: 2021-03-05
SHENZHEN CANNICE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small size of the TWS earphones, and the position accuracy of the solder connection is generally below 0.1mm, the solder connection method is likely to generate high-temperature radiation and damage the electronic components around the solder point, and the solder connection method is likely to cause product yield. The result of the decline, and it is not conducive to improving the reliability of TWS earphones

Method used

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  • TWS earphone
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Embodiment Construction

[0034] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner" and "outer" are based on those shown in the accompanying drawings. Orientation or positional relationship is only for the convenience of describing ...

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Abstract

The invention discloses a TWS earphone, which comprises a circuit board and a power line used for being electrically connected with the circuit board. The power line comprises a conductive wire made of a metal material and an insulating layer coating the conductive wire, and a conduction connecting frame capable of elastic deformation is pasted on the circuit board; a connecting groove with an outward opening is formed in the conduction connecting frame, and a gap with the width smaller than the diameter of the conductive wire is formed between the groove walls of the two opposite sides of theconnecting groove; cutter assemblies are arranged on the groove walls of the two opposite sides of the connecting groove or the groove edges of the two opposite sides of a groove opening of the connecting groove. A cutting gap is formed in the cutter assembly, when the power line is extruded to enter the gap along the cutting gap, the cutter cuts the insulating layer open, the conductive wire passes through the cutting gap, and the two opposite sides of the conductive wire abut against the groove walls of the two opposite sides of the connecting groove respectively. According to the TWS earphone provided by the invention, the conduction connection with the power line is realized through the conduction connecting frame capable of elastic deformation, so that the welding and fixing operation is omitted, and the effects of electric conduction and fixing are also achieved.

Description

technical field [0001] The invention relates to the technical field of bluetooth earphones, in particular to a TWS earphone. Background technique [0002] TWS (True Wireless Stereo) earphones, that is, true wireless stereo earphones, use Bluetooth connections instead of physical wires, which are more convenient to use and are favored by consumers. [0003] In the prior art, the battery in the TWS earphone is connected to the circuit board in the TWS earphone through two power lines, and the power line is soldered to the circuit board by an electric soldering iron. However, due to the small size of the TWS earphones, and the position accuracy of the solder connection is generally below 0.1mm, the solder connection method is likely to generate high-temperature radiation and damage the electronic components around the solder point, and the solder connection method is likely to cause product yield. The result of the decline is not conducive to improving the reliability of TWS e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R4/2425H01R12/75H04R1/10
CPCH01R4/2425H01R12/75H04R1/1058
Inventor 郭霞云刘玉诚
Owner SHENZHEN CANNICE TECH