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Multi-dimensional vector acceleration factor characterization method for electronic product

A technology of acceleration factor and electronic products, applied in the field of accelerated life test, it can solve the problem that the failure process and mechanism are not considered, and the characterization of the acceleration factor stays in the double stress model.

Pending Publication Date: 2021-03-09
BEIJING INST OF STRUCTURE & ENVIRONMENT ENG
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Problems solved by technology

Although various universities and scientific research institutions have carried out a lot of research on multi-stress accelerated tests, the characterization of acceleration factors mostly stays in the dual-stress model, and most of the statistical models do not take into account the actual failure process and mechanism, as well as the relationship between multiple stresses. coupling effect

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  • Multi-dimensional vector acceleration factor characterization method for electronic product
  • Multi-dimensional vector acceleration factor characterization method for electronic product
  • Multi-dimensional vector acceleration factor characterization method for electronic product

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Embodiment Construction

[0061] The invention relates to a method for characterizing multi-dimensional vector acceleration factors of electronic products, comprising the following steps:

[0062] S1. Determine the use environment of electronic products;

[0063] S2. Specify the type of accelerated stress in the use environment;

[0064] S3. Determine the failure time model;

[0065] S4. Determine the vector representation of the failure time model;

[0066] S5. Determine the acceleration factor vector representation;

[0067] S6. Numerically solving the acceleration factor.

[0068] Wherein, in step S2, according to the structural characteristics of the electronic product, the type of packaging process, and the environmental conditions of use, environmental factors that are likely to cause failure of the electronic product are selected as the type of accelerated stress.

[0069] The accelerated stress includes temperature, humidity, vibration, electrical stress, and mechanical stress.

[0070] Wh...

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Abstract

The invention relates to a multi-dimensional vector acceleration factor characterization method for an electronic product. The method comprises the following steps: defining the type of acceleration stress in a use environment, determining a failure time model, determining vector characterization of the failure time model, determining acceleration factor vector characterization, and carrying out numerical solution on an acceleration factor. According to the characterization method, the failure process and mechanism of the electronic product can be fully reflected, the coupling effect among multiple stresses can be characterized through the covariance matrix of the acceleration stress, and accurate characterization of multiple stress acceleration factors is achieved.

Description

technical field [0001] The invention relates to a multi-dimensional vector acceleration factor characterization method for electronic products, belonging to the technical field of accelerated life tests. Background technique [0002] During the entire life cycle of electronic products, failure is usually caused by a variety of environmental factors. According to the statistical analysis of the failure causes of electronic products by the U.S. Air Force, 40% of the failures in electronic products are caused by temperature, and 27% of the failures are caused by temperature. It is caused by vibration, 19% of failures are caused by humidity, and the remaining 14% of failures are caused by environmental factors such as smog, dust, low pressure, etc. It can be seen that the environments that affect the reliability of electronic products are diverse . [0003] Product reliability evaluation and verification is usually to obtain product life information by life test, and then perfo...

Claims

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Application Information

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IPC IPC(8): G06F30/20G06F17/16G06F119/14G06F119/02G06F119/04
CPCG06F30/20G06F17/16G06F2119/14G06F2119/02G06F2119/04
Inventor 吴建国陈志军冯国林朱仪凡贾洲侠李志强刘宝瑞李艳芬程昊于荣刚李尧
Owner BEIJING INST OF STRUCTURE & ENVIRONMENT ENG
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