Water-cooling pressure head on mobile phone display screen bonding equipment

Abstract

The invention belongs to the technical field of mobile phone display screen manufacturing, and particularly relates to a water-cooling pressure head on mobile phone display screen bonding equipment, which comprises two water-cooling glands, pressure head mounting blocks are arranged on the sides, close to each other, of the two water-cooling glands, and the pressure head mounting blocks are fixedly connected with the two water-cooling glands; and a tool bit is fixedly mounted on the pressure head mounting blocks, end covers are fixedly mounted on the two sides of the pressure head mounting blocks correspondingly, the two end covers make contact with the two sides of the two water-cooling glands correspondingly, and first cooling water pipes are fixedly mounted on the same sides of the twoend covers correspondingly. According to the invention, poor contact and mechanical connection of the electronic circuit caused by springback of the material due to evacuation of the pressure head ina high-temperature state in the bonding process of the FPC electronic circuit are avoided.

Description

technical field [0001] The invention relates to the technical field of mobile phone display screen manufacturing, in particular to a water-cooled pressure head on a mobile phone display screen bonding device. Background technique [0002] Bonding indenters are widely used in mobile phone screen liquid crystal display module LCM (Liquid Display Module) combined connection bonding process equipment; that is, liquid crystal display, drive circuit, FPC (Flexible Printed Circuit, flexible printed circuit board), backlight The components assembled together with other structural parts, and the mechanical connection and electrical conduction between the liquid crystal glass, the drive circuit and the FPC in the liquid crystal display are the core parts of the LCM production, and the production process of the liquid crystal glass and the FPC is FOG (Film On Glass ) bonding process, which is to mount the FPC on the glass panel; and the process equipment in the FOG bonding process will...

AI Technical Summary

Problems solved by technology

Therefore, after the material is heated, it needs to be cooled naturally, and the material of the product rebounds at a high temperature, resulting in poor contact of the electronic pin circuit, which not only reduces the conduction strength and adhesion of the circuit connection between the FPC and the liquid crystal glass, Moreover, the electrode pins of FPC and liquid crystal glass will have an induced open circuit due to the particle situation. The existing FOG process bonding LCM products have serious quality risks. For this reason, a mobile phone display bonding device is proposed. Water cooling head

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