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Semiconductor packaging all-in-one machine

A technology of semiconductors and all-in-one machines, applied in the field of automation equipment, can solve problems such as low automation, low efficiency, and poor integration, and achieve the effects of low labor costs, high efficiency, and high integration

Active Publication Date: 2021-03-12
SHENZHEN XINYICHANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiment of the present application is to provide an integrated semiconductor packaging machine to solve the problems of poor integration, low automation and low efficiency of semiconductor packaging equipment in the related art

Method used

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  • Semiconductor packaging all-in-one machine
  • Semiconductor packaging all-in-one machine
  • Semiconductor packaging all-in-one machine

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Embodiment Construction

[0050] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0051] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0052] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specify...

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Abstract

The invention provides a semiconductor packaging all-in-one machine. The semiconductor packaging all-in-one machine comprises a rack, a first feeding mechanism used for supplying a first support, a dispensing mechanism used for dispensing the first support, a chip supply mechanism used for supplying a chip, a die bonding mechanism used for fixedly arranging the chip on the first support, a secondfeeding mechanism used for supplying a second support, a laminating mechanism used for laminating the second support and the first support to form a laminated body, and a reflow soldering mechanism used for carrying out reflow soldering treatment on the laminated body. The chip can be fixedly arranged on the first support through the dispensing mechanism, the chip supply mechanism and the die bonding mechanism, the second support can be attached to the first support through the laminating mechanism to form the laminated body, and the reflow soldering mechanism can conduct reflow soldering treatment on the laminated body. Therefore, the semiconductor packaging all-in-one machine can realize automatic lamination of the second support and the first support and automatic reflow soldering treatment of the laminated body, and has the advantages of high integration degree, high automation degree, high efficiency and the like.

Description

technical field [0001] The present application belongs to the technical field of automation equipment, and more specifically relates to a semiconductor packaging integrated machine. Background technique [0002] Semiconductor packaging is the process of reflow soldering the brackets with solidified solder joints, and processing the tested wafers to obtain independent chips according to the product model and functional requirements. With the maturity of semiconductor packaging technology, there are higher requirements for the integration and reliability of semiconductor packaging equipment. [0003] In the process of semiconductor packaging, it is necessary to dispense glue on the first bracket, fix the chip on the first bracket, then attach the second bracket to the first bracket, and finally transport the bonded bracket to the reflow soldering equipment. Reflow soldering treatment, so as to realize the packaging of semiconductors. However, the current semiconductor packag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67144
Inventor 梁志宏
Owner SHENZHEN XINYICHANG TECH CO LTD
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