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Method for mounting lens in glue-free eutectic manner and LED packaging structure

A lens and eutectic furnace technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as unstable installation, lens falling off, reliability and light effect, and achieve stable installation, not easy to fall off, and stable installation reliable effect

Inactive Publication Date: 2021-03-12
中芯先进半导体(深圳)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the above-mentioned process has very strict requirements on the dispensing amount of organic glue. If there is less organic glue, there will be gaps and the installation will not be firm; if there is too much organic glue, the glue will overflow. With the irradiation of UV light, the organic glue will age. As a result, it is easy to cause the lens to fall off, which not only affects the service life of the UV lamp beads, but also seriously affects the reliability and light output effect.

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  • Method for mounting lens in glue-free eutectic manner and LED packaging structure

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Embodiment Construction

[0023] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "front", "upper", "lower", "left", "right", "vertical", "horizontal" etc. are based on The orientation or positional relationship shown in the drawings is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and opera...

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Abstract

The invention provides a method for mounting a lens in a glue-free eutectic manner and an LED packaging structure, and relates to the technical field of LED packaging, and the method comprises the following steps: A, plating at least one metal alloy layer on the mounting surface of the lens according to the size of a base step; B, dispensing a proper amount of scaling powder on a base step; C, mounting the lens on the base, and aligning the metal alloy layer on the mounting surface of the lens with the base step; D, putting the base with the lens into a vacuum eutectic furnace for eutectic operation; and E, taking out the base with the lens from the eutectic furnace, and cooling to room temperature under a natural condition. According to the method for mounting the lens in the glue-free eutectic mode, the metal alloy layer is plated on the edge of the installation face of the lens, and then the stable installation of the lens and the base is achieved through the scaling powder and theeutectic step.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a method for installing an adhesive-free eutectic lens and an LED packaging structure. Background technique [0002] LED packaging technology refers to the process of installing LED chips on the base and covering the lens. UV LED refers to ultraviolet light-emitting diodes. UV LEDs need to be covered with lenses such as quartz or sapphire when packaged. The usual method is to apply silicone or UV shadowless glue on the bracket steps of the base through the glue dispensing process, then cover the lens, and finally perform heat curing or light curing to complete the fixing of the lens and the base. [0003] However, the above-mentioned process has very strict requirements on the dispensing amount of organic glue. If there is less organic glue, there will be gaps and the installation will not be firm; if there is too much organic glue, the glue will overflow. With the irradia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/58
CPCH01L33/48H01L33/52H01L33/58
Inventor 陈其祥宋娟刘中焱冉崇胜邓玉仓
Owner 中芯先进半导体(深圳)有限公司
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