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Lightweight high-thermal-conductivity plate

A high thermal conductivity, lightweight technology, applied in the direction of modification, cooling/ventilation/heating transformation through conduction heat transfer, etc., to achieve the effect of satisfying mechanical strength, light weight and good heat dissipation effect

Pending Publication Date: 2021-03-12
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, hot materials researched on the market, such as graphite plates with a certain thickness, have an in-plane thermal conductivity higher than 1000W / (m·K). Directly used as a structural part with heat dissipation function

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0023] Such as Figure 1-2 As shown, this embodiment provides a lightweight high thermal conductivity plate, including: an aluminum alloy outer plate 1, an aluminum alloy inner plate 2, a graphite sandwich panel 3 and a connecting layer 4, the aluminum alloy outer plate 1 is provided with a placement groove, The aluminum alloy inner panel 2 is arranged in the placement groove, the graphite sandwich panel 3 is arranged between the aluminum alloy outer panel 1 and the aluminum alloy inner panel 2, and the graphite sandwich panel 3 The upper and lower ends are respectively fixedly connected to the aluminum alloy inner panel 2 and the aluminum alloy outer panel 1 through the connecting layer 4 .

[0024] The application provides a light-weight and high-thermal-conduction plate, which uses an aluminum alloy outer plate 1 as a base plate, cooperates with a graphite sandwich plate 3, has good thermal conductivity, meets the requirements of mechanical strength, has good heat dissipati...

Embodiment 2

[0028] Such as Figure 1-2 As shown, this embodiment provides a lightweight high thermal conductivity plate, including: an aluminum alloy outer plate 1, an aluminum alloy inner plate 2, a graphite sandwich panel 3 and a connecting layer 4, the aluminum alloy outer plate 1 is provided with a placement groove, To facilitate the embedding of the graphite sandwich panel 3, the aluminum alloy inner panel 2 is arranged in the placement groove, and the graphite sandwich panel 3 is arranged between the aluminum alloy outer panel 1 and the aluminum alloy inner panel 2 , the upper and lower ends of the graphite sandwich panel 3 are respectively fixedly connected to the aluminum alloy inner panel 2 and the aluminum alloy outer panel 1 through the connecting layer 4, and the bottom of the aluminum alloy outer panel 1 Two supporting columns 6 are arranged at intervals along the length direction, which has good supporting effect and high stability.

[0029] The application provides a light...

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Abstract

The invention relates to a light high-thermal-conductivity plate, and belongs to the technical field of thermal-conductivity plates. The light high-thermal-conductivity plate comprises an aluminum alloy outer plate, an aluminum alloy inner plate, a graphite sandwich plate and a connecting layer, a containing groove is formed in the aluminum alloy outer plate, the aluminum alloy inner plate is arranged in the containing groove, the graphite sandwich plate is arranged between the aluminum alloy outer plate and the aluminum alloy inner plate, and the upper end and the lower end of the graphite sandwich plate are fixedly connected to the aluminum alloy inner plate and the aluminum alloy outer plate through the connecting layers respectively. The light high-thermal-conductivity plate has the advantages of meeting the requirement for mechanical strength, and being good in radiating effect and light in weight.

Description

technical field [0001] The invention belongs to the technical field of heat conduction plates, and in particular relates to light and high heat conduction plates. Background technique [0002] With the development of electronic technology, the integration of electronic equipment is getting higher and higher. Due to the improvement of integration, some complex electronic systems, such as radar, are gradually being applied to platforms such as helicopters, drones, and satellites. Value. Platforms such as helicopters, drones, and satellites have extremely strict restrictions on the volume, weight, and power consumption of equipment. Therefore, lightweight design has become the key to whether complex systems can be equipped with airborne or spaceborne platforms. At the same time, the heat dissipation design of complex electronic systems is an important guarantee for determining whether the equipment can work normally. At present, hot materials researched on the market, such as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 刘晓红
Owner BEIJING INST OF RADIO MEASUREMENT