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Cleaning bath

A technology for a bathtub and a side wall is applied in the field of cleaning the bathtub, which can solve the problems such as inability to perform good ultrasonic treatment, uneven cleaning, and unevenness.

Pending Publication Date: 2021-03-16
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the cleaning bath, the case moves due to the vibration caused by the ultrasonic waves, and there is a possibility that the ultrasonic treatment cannot be performed satisfactorily.
[0006] Also, even if the movement of the cartridge is stopped, depending on the shape of the cleaning bath and the cartridge, standing waves may be generated in the treatment liquid in the cleaning bath.
In this case, the unevenness of the sound pressure is caused by the standing wave, thereby generating unevenness in cleaning, and especially a thin semiconductor substrate (such as a semiconductor substrate for a solar cell) is affected by the antinode portion of the standing wave (acoustic The part with high pressure) is easily damaged by pressing

Method used

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Examples

Experimental program
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Embodiment Construction

[0030] Hereinafter, illustrated embodiments will be described in detail based on the drawings.

[0031] Figure 1 ~ Figure 3 The cleaning bath 21 according to the illustrated embodiment is shown. This cleaning bath 21 is made to hold at least one (in this embodiment, a plurality of) semiconductor substrates 57 (refer to Figure 4 ) in a state where the cartridge 51 is immersed in the stored processing liquid, and ultrasonic processing is performed on at least one (plural) semiconductor substrate 57 . In this embodiment, the semiconductor substrate 57 is a semiconductor substrate for the solar cell 10 . In addition, in image 3 In , description of the semiconductor substrate 57 is omitted.

[0032] Here, based on Figure 5 as well as Figure 6 The structure of the solar cell 10 will be described. The solar cell 10 uses a crystalline substrate 11 made of silicon (Si). Crystalline substrate 11 has two main surfaces 11S ( 11SU, 11SB) facing each other. Here, the principal...

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Abstract

A cleaning bath (21) for subjecting a semiconductor substrate (57) retained in a cassette (51) to ultrasonic treatment is provided with: a bottom wall portion (22); a tubular side wall portion (23) which rises from the bottom wall portion (22) and inside which a treatment liquid is stored; and an inhibiting portion (30) which inhibits movement of the cassette (51), immersed in the treatment liquid, in an in-plane direction of the bottom wall portion (22) and in an intersecting direction with respect to the in-plane direction. In a cross section perpendicular to the direction of a tubular axisof the tubular side wall portion (23), a part, in a perimetrical direction, of an inside surface of the tubular side wall portion (23) is a curve, and the remainder thereof is a straight line.

Description

technical field [0001] The technology disclosed in this specification relates to a cleaning bath for ultrasonically processing a semiconductor substrate. Background technique [0002] Conventionally, it is known to hold a semiconductor substrate in a cartridge in order to immerse the semiconductor substrate in a treatment solution in a cleaning bath for ultrasonic treatment. For example, in Patent Document 1, a substrate (in Patent Document 1, a transparent substrate of a liquid crystal display element) is held in a case, and the substrate held in the case is immersed in a treatment liquid of a cleaning bath together with the case. The substrate is ultrasonically treated. [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 6-138437 [0004] However, when patterning a thin film formed on a silicon wafer by a lift-off method, the patterning step includes a thin-film lift-off step. When ultrasonic treatment is introduced in this peeling process, the yield o...

Claims

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Application Information

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IPC IPC(8): H01L21/304B08B3/12
CPCH01L21/304B08B3/12
Inventor 渡边真悟口山崇
Owner KANEKA CORP