Packaging reinforcement method for high-reliability application of high-power LED

Abstract

The invention discloses a packaging reinforcement method for high-reliability application of a high-power LED. The method comprises the following steps that: S1, an LED packaging body is provided, wherein the LED packaging body is provided with a substrate part, a reflector part and an LED lens part, and a circumferential gap is formed between the bottom surface of the LED lens part and the top surface of the reflector part; S2, a reinforcing glue body is provided, wherein the thermal expansion coefficient of the reinforcing glue body is the same as or similar to the thermal expansion coefficient of the LED packaging body; and S3, reinforcing glue points are arranged through the reinforcing glue body, the reinforcing glue points are formed on the periphery of the circumferential gap, the reflector part and the LED lens part are bonded together through the reinforcing glue points, and the length, sealed by the reinforcing glue points, of the circumferential gap is not larger than half of the total length of the circumferential gap. The method prolongs the service life of the high-power LED and improves the environmental tolerance of the high-power LED.

Description

technical field [0001] The invention relates to a packaging and strengthening method for high-power LED high-reliability applications. Background technique [0002] High-power LEDs are high-performance and high-quality light source devices that have emerged in recent years, and are widely used in military and civil aviation airborne lighting systems. The reliability of the airborne lighting system has a crucial impact on the human-computer interaction, light signal transmission and flight safety of the aircraft, and is highly valued by the airborne equipment manufacturers. At present, most high-power LEDs on the market cannot effectively take into account the high-performance, high-power and high-reliability applications of the device. In order to meet product performance requirements, the selected high-power LEDs (without encapsulation and reinforcement measures) frequently suffer from problems such as lens falling off and light guide adhesive cracking after undergoing hig...

AI Technical Summary

Problems solved by technology

However, high-power LEDs will release a large amount of heat energy during use, resulting in volume changes of internal materials under their respective thermal expansion coefficients. Reinforcement glue with mismatched thermal expansion coefficients will increase the internal stress of the light guide adhesive inside the LED, and also significantly reduce its own attachment. After repeated use, the reinforcing glue may even fall off by itself

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