Circuit board with heat dissipation structure and manufacturing method thereof
A technology of heat dissipation structure and manufacturing method, which is applied in printed circuit manufacturing, printed circuit, circuit thermal device and other directions, can solve problems such as unsatisfactory heat dissipation effect, and achieve the effect of high structural reliability, good heat dissipation effect and mature material.
Active Publication Date: 2022-05-27
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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Problems solved by technology
In order to solve the problem of heat dissipation of the circuit board, the prior art generally dissipates heat from the circuit board by arranging heat-conducting glue or embedding copper blocks on the circuit board, but the heat dissipation effect is not ideal.
Method used
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[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0033] In order to further illustrate the technical means and ...
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The present invention proposes a method for manufacturing a circuit board with a heat dissipation structure, comprising the following steps: providing a circuit substrate; opening at least one heat conduction hole in the circuit substrate; filling each heat conduction hole with a heat conduction medium, thereby forming A heat conduction column, wherein each of the heat conduction columns includes a first end and a second end opposite to the first end, and the second end is exposed to the circuit substrate; forming a heat conduction layer on the surface of the circuit substrate, so that the heat conduction layer is in contact with the second end; and forming an electronic component on the surface of the circuit substrate away from the heat conduction layer, so that the electronic component faces the The first end is in thermal communication with the first end, so as to obtain the circuit board with heat dissipation structure. The manufacturing method of the circuit board with the heat dissipation structure provided by the invention has better heat dissipation effect. The invention also provides a circuit board with a heat dissipation structure prepared by the method.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board with a heat dissipation structure and a manufacturing method thereof. Background technique [0002] Electronic products are constantly developing in the direction of light weight, high frequency, high density and high performance. At present, 5G communication is gradually implemented, and the radio frequency performance of circuit boards such as radio frequency antennas is continuously improved, which leads to a large amount of heat dissipation of some components. , it is easy to cause local overheating of the circuit board. In order to solve the problem of heat dissipation of the circuit board, the prior art generally dissipates heat from the circuit board by arranging thermally conductive adhesive or embedding copper blocks on the circuit board, but the heat dissipation effect is not ideal. SUMMARY OF THE INVENTION [0003] In view of this, the present...
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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0206H05K1/0209H05K3/0088
Inventor 李艳禄
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD