Chip packaging structure, manufacturing method and electronic device
A chip packaging structure and chip technology, applied in the field of semiconductors, can solve problems such as poor integration of antenna structures, and achieve the effects of compact structure, powerful functions, and miniaturization.
Active Publication Date: 2021-04-20
FOREHOPE ELECTRONICS NINGBO CO LTD
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Problems solved by technology
However, the integration of the existing silicon microphone chip package structure and antenna structure is poor
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[0039] With the IC radio frequency antenna structure widely used in the semiconductor industry, and the application of electronic products in the iteration of high-frequency and low-frequency signals in the communication field, it is required that electronic products (such as microphones and mobile communication equipment) have the functions of MEMS silicon wheat products. , but also have the function of an antenna to meet the needs of its high / low frequency signal transmission. However, in the design of existing electronic equipment, the MEMS silicon wheat product and the antenna structure for receiving and processing acoustic signals are two independent products, and there is no technology for combining the radio frequency antenna structure and the MEMS silicon wheat structure. This results in a low level of integration of electronic devices with multiple functions, and the miniaturization is limited. Moreover, in the prior art method for fabricating an IC radio frequency an...
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The invention provides a chip packaging structure, its manufacturing method and electronic equipment, and relates to the field of semiconductors. The chip packaging structure includes a substrate, a microphone chip and a processing chip arranged on the substrate, a protective cover covering the microphone chip and the processing chip, a radio frequency chip arranged on the outer surface of the protective cover, a package wrapping the protective cover and the radio frequency chip, and a package placed on the Antenna on the surface of the package. By placing the antenna on the surface of the package, placing the radio frequency chip outside the protective cover, and then connecting the two through the first transmission line, the integration of the antenna structure with the microphone chip and the processing chip is realized, making the chip package structure functional Strong enough to meet more usage requirements; and compact in structure, which is conducive to the miniaturization of electronic equipment. The fabrication method provided by the present invention is used to fabricate the above-mentioned chip packaging structure. An electronic device provided by an embodiment of the present invention includes the above-mentioned chip packaging structure.
Description
technical field [0001] The invention relates to the field of semiconductors, in particular to a chip packaging structure, a manufacturing method thereof and electronic equipment. Background technique [0002] With the rapid development of the semiconductor industry, microphones have been widely used in various electronic products in the consumer field, among which silicon microphones have been widely used in mobile terminals due to their small size and strong stability. The chip package structure of the silicon microphone includes a MEMS (Micro Electro Mechanical System, Micro Electro Mechanical System) chip and an ASIC (Application Specific Integrated Circuit) chip, which are used to receive and process acoustic signals. As electronic products are used in the iteration of high-frequency and low-frequency signals in the communication field, MEMS silicon wheat products are required to have antenna functions. However, the integration degree of the chip package structure and t...
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IPC IPC(8): B81B7/00B81C1/00H01Q1/22H04R19/00H04R19/04
CPCB81B7/0032B81B7/007B81B2201/0257B81C1/0023B81C1/00261B81C1/00301H01Q1/2283H04R19/005H04R19/04H04R2201/003
Inventor 孙成富李利何正鸿
Owner FOREHOPE ELECTRONICS NINGBO CO LTD