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A detection method and detection equipment for an audio chip

An audio chip and detection method technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve the problems of low strength, easy bending, wrong performance parameters of testing equipment, etc. The effect of improving capacity and increasing production efficiency

Active Publication Date: 2022-06-28
HEAD DIRECT KUNSHAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the link between chip products and external circuits, chip pins usually have low-strength and easy-to-bend mechanical properties. During the above-mentioned quality inspection process, they are often prone to sound due to manual clamping operations or clamping errors of non-high-precision automation equipment. The poor connection between the chip pins and the inspection tool makes the inspection equipment feed back wrong performance parameters, which eventually leads to misjudgment of the quality inspection results of the chip product
Moreover, in the production process, the cause of defective products should be analyzed to ensure that the systematic error of the production equipment is eliminated and the production process is improved. Inside the chip assembly, it is difficult to efficiently visualize and analyze its internal real structure and state

Method used

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  • A detection method and detection equipment for an audio chip
  • A detection method and detection equipment for an audio chip
  • A detection method and detection equipment for an audio chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] see figure 1 , image 3 as well as Figure 4 ,in, figure 1 It is a schematic flowchart of the detection method of the audio chip according to the embodiment of the present invention; image 3 It is a schematic diagram of the internal structure of the audio chip package; Figure 4 It is a schematic diagram of the integrated circuit structure inside the audio chip package.

[0040] This embodiment provides an audio chip detection method, which is used for electrical function detection and failure cause analysis of the audio chip 100 to be tested, including:

[0041] Clamping step 1 S110: the audio chip 100 to be tested is transferred to the electric measurement fixture 220 by the electrical measuring fixture 210 for clamping;

[0042] Step S120 of electrical measurement: The electrical measurement fixture 220 performs electrical function detection on the audio chip 100 to be tested to determine whether the electrical function of the audio chip 100 to be tested is qua...

Embodiment 2

[0058] see figure 2 ,in, figure 2 It is a schematic structural diagram of a detection device for an audio chip according to an embodiment of the present invention.

[0059] This embodiment provides an audio chip detection device 200, which is used to implement the above-mentioned audio chip detection method, which specifically includes:

[0060] The electrical measuring fixture 210 is used to transfer the audio chip 100 to be tested to the electrical measuring fixture 220; the electrical measuring fixture 220 is used to clamp the audio chip 100 to be tested and perform electrical functions on the audio chip 100 to be tested Detection, to determine whether the electrical function of the audio chip 100 to be tested is qualified; the processing module 230 is used to judge whether the detection process is over according to the detection result 31 of the electrical function detection, if the detection result 31 of the electrical function detection is qualified , then it is judg...

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Abstract

The invention provides an audio chip detection method and detection equipment, which are used for electrical function detection and failure cause analysis of the audio chip to be tested, including clamping step 1, electrical measurement step, evaluation step 1, imaging step 1, and evaluation step 2 , clamping step 2, imaging step 2, analysis step, wherein the imaging step is performed by the imaging device and the perspective imaging fixture to image the appearance connection of the pins of the audio chip to be tested and the internal structure of the package to obtain the imaging result, so as to obtain the imaging result through the imaging analysis method Realized the process of checking whether there is any misjudgment of defective products caused by connection problems during the electrical function detection process of the audio chip, and provided an analysis basis for further analysis of the product circuit structure inside the package that caused failure or low functional parameters, and improved Production efficiency and manufacturing process improvement capabilities for audio chips.

Description

technical field [0001] The invention relates to the field of production detection of audio chips, in particular to a detection method and detection equipment of audio chips. Background technique [0002] In the quantitative production process of industrial products, in order to ensure the quality of the outgoing products, the semi-finished products or finished products of the products will be measured and tested in each stage of production. For chip products, after the overall product packaging is completed, they will undergo functional testing through the quality inspection process to ensure that the functional technical indicators of the chip products meet the technical requirements. Usually, this quality inspection process includes an electrical inspection step, which electrically connects the chip product with the electrical inspection equipment or inspection tool through manual or automated equipment, and then runs or starts the function inspection program or function t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R1/04
CPCG01R31/2886G01R31/2884G01R1/0425
Inventor 边仿
Owner HEAD DIRECT KUNSHAN CO LTD
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