Air conditioner
A technology of air conditioners and electronic components, which is applied in the direction of modification by liquid cooling, modification by conduction heat transfer, cooling/ventilation/heating modification, etc. It can solve the problems of low efficiency of air cooling and condensation of refrigerant heat dissipation, etc. Achieve the effects of miniaturization design, high heat dissipation efficiency, convenient and quick maintenance and replacement
Active Publication Date: 2021-03-26
QINGDAO HISENSE HITACHI AIR CONDITIONING SYST
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Problems solved by technology
[0008] The invention provides an air conditioner, which solves the technical problems in the prior art that the efficiency of air cooling and heat dissipation of electronic components is low, and the condensation of refrigerant heat is generated.
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[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0021] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; either directly or indirectly through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms i...
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The invention relates to an air conditioner. The air conditioner comprises an electronic component and an electronic component heat dissipation device. The electronic component heat dissipation devicecomprises a heat pipe heat dissipation assembly and a refrigerant heat dissipation assembly, and the heat pipe heat dissipation assembly comprises a heat pipe heat dissipation plate and a heat pipe located in the heat pipe heat dissipation plate. The refrigerant heat dissipation assembly comprises a refrigerant heat dissipation plate and a refrigerant pipe located in the refrigerant heat dissipation plate, the heat pipe heat dissipation plate is connected with the electronic component, and the refrigerant heat dissipation plate is connected with the heat pipe heat dissipation plate. Heat is dissipated through the refrigerant heat dissipation assembly and the heat pipe heat dissipation assembly, the heat dissipation efficiency is high, and a miniaturization design of the electronic component is facilitated. Due to the fact that the heat dissipation temperature of the heat pipe is high, a condensation problem can be well avoided. Besides, a working medium is packaged in the heat pipe, acertain service life is achieved, in a maintenance process, only the original heat pipe heat dissipation plate needs to be removed, the new heat pipe heat dissipation plate is coated with a heat conduction medium up and down and then is reinstalled and fixed, and maintenance and replacement are convenient and fast.
Description
technical field [0001] The invention relates to the technical field of air conditioners, in particular to an air conditioner. Background technique [0002] With the improvement of the integration degree of electronic components, the heat generation density has also increased sharply. How to effectively dissipate heat has become a key factor in the development of electronic components. The same problem is faced in the field of air conditioning. At present, inverter air conditioners have become the mainstream of the market due to their advantages such as high efficiency, energy saving, low noise, and fast temperature adjustment. However, the frequency converter and other components have high power and high heat generation. If the heat cannot be discharged in time, the high temperature will inevitably cause damage to the frequency converter and seriously affect the operation of the whole machine. Therefore, effective heat dissipation structure design is very important. [0003...
Claims
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IPC IPC(8): H05K7/20
CPCH05K7/20309H05K7/20318H05K7/2039H05K7/20218
Inventor 耿世超王战术李丛来曹培春徐亚男
Owner QINGDAO HISENSE HITACHI AIR CONDITIONING SYST