A six-degree-of-freedom micro-motion device and electron beam equipment

A micro-motion device and a technology with a degree of freedom, which is applied to microlithography exposure equipment, photolithography exposure devices, electrical components, etc. small effect

Active Publication Date: 2021-06-01
YINGUAN SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The embodiment of this patent can be used in semiconductor equipment, but the influence of magnetic flux leakage is not considered, especially for the cylindrical voice coil motor used in this solution, magnetic flux leakage is very serious

Method used

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  • A six-degree-of-freedom micro-motion device and electron beam equipment
  • A six-degree-of-freedom micro-motion device and electron beam equipment
  • A six-degree-of-freedom micro-motion device and electron beam equipment

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Embodiment Construction

[0058] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0059] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two ...

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Abstract

The invention relates to the technical field of integrated circuit equipment manufacturing, and discloses a six-degree-of-freedom micro-motion device and electron beam equipment. The micro-motion device includes a silicon wafer carrier, a moving assembly, a fixed assembly and a driving assembly. The moving assembly includes a moving plate and an upper magnetic shielding structure; the fixed assembly includes a connecting plate and a lower magnetic shielding structure, and the lower magnetic shielding structure cooperates with the upper magnetic shielding structure. A magnetically shielded space is formed; the driving assembly is arranged in the magnetically shielded space, including a first horizontal voice coil motor and a first vertical voice coil motor arranged along a first direction, a second horizontal voice coil motor and a first vertical voice coil motor arranged along a second direction Two vertical voice coil motors, and a third horizontal voice coil motor and a third vertical voice coil motor arranged along the third direction; the moving parts of each voice coil motor are connected with the upper magnetic shielding structure; each voice coil motor adopts Double-coil planar voice coil motor. The invention can provide the precision movement of six degrees of freedom for the silicon chip, and can reduce the magnetic flux leakage of the motor, and the magnetic flux leakage energy on the surface of the silicon chip can reach the nT level.

Description

technical field [0001] The invention relates to the technical field of integrated circuit equipment manufacturing, in particular to a six-degree-of-freedom micro-motion device and electron beam equipment. Background technique [0002] In high-end semiconductor equipment, such as electron beam equipment, a coarse and fine-motion double-layer motion structure is widely used to form an ultra-precision motion platform. The positioning accuracy of the nanoscale six-degree-of-freedom micro-motion stage determines the electron beam equipment. The exposure accuracy and operating speed determine the production efficiency. In the next generation of vacuum semiconductor equipment, such as electron beam lithography or wafer inspection, the requirements for ultra-precise motion are greatly increased. Not only the motion table is required to have nano-level motion positioning accuracy, but also high vacuum, low magnetic flux leakage, and low Fever and other requirements. [0003] The na...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H05K9/00
CPCG03F7/70716G03F7/70758G03F7/70808H05K9/00H05K9/0075
Inventor 胡兵江旭初蒋赟
Owner YINGUAN SEMICON TECH CO LTD
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