Six-degree-of-freedom micro-motion device and electron beam equipment

A micro-motion device and a technology of degrees of freedom, which are applied in microlithography exposure equipment, photolithography exposure devices, electrical components, etc., can solve problems such as not considering the influence of magnetic flux leakage, and achieve reduced magnetic leakage and Small, reduce the effect of magnetic flux leakage

Active Publication Date: 2021-04-02
YINGUAN SEMICON TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

The embodiment of this patent can be used in semiconductor equipment, but the influence of magnetic flux leakage is not considered, especially for the cylindrical voice coil motor used in this solution, magnetic flux leakage is very serious

Method used

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  • Six-degree-of-freedom micro-motion device and electron beam equipment
  • Six-degree-of-freedom micro-motion device and electron beam equipment
  • Six-degree-of-freedom micro-motion device and electron beam equipment

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Embodiment Construction

[0058] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0059] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two ...

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Abstract

The invention relates to the technical field of integrated circuit equipment manufacturing, and discloses a six-degree-of-freedom micro-motion device and electron beam equipment. The micro-motion device comprises a silicon wafer bearing table, a motion assembly, a fixing assembly and a driving assembly, and the motion assembly comprises a motion plate and an upper magnetic shielding structure; thefixing assembly comprises a connecting plate and a lower magnetic shielding structure, and the lower magnetic shielding structure and the upper magnetic shielding structure are matched to form a magnetic shielding space; the driving assembly is arranged in the magnetic shielding space and comprises a first horizontal voice coil motor and a first vertical voice coil motor which are arranged alonga first direction, a second horizontal voice coil motor and a second vertical voice coil motor which are arranged along a second direction, and a third horizontal voice coil motor and a third verticalvoice coil motor which are arranged along a third direction; the moving part of each voice coil motor is connected with the upper magnetic shielding structure; and each voice coil motor is a double-coil type flat voice coil motor. Six-degree-of-freedom precision motion can be provided for a silicon wafer, motor magnetic flux leakage can be reduced, and magnetic flux leakage on the surface of thesilicon wafer reaches the nT magnitude.

Description

technical field [0001] The invention relates to the technical field of integrated circuit equipment manufacturing, in particular to a six-degree-of-freedom micro-motion device and electron beam equipment. Background technique [0002] In high-end semiconductor equipment, such as electron beam equipment, a coarse and fine-motion double-layer motion structure is widely used to form an ultra-precision motion platform. The positioning accuracy of the nanoscale six-degree-of-freedom micro-motion stage determines the electron beam equipment. The exposure accuracy and operating speed determine the production efficiency. In the next generation of vacuum semiconductor equipment, such as electron beam lithography or wafer inspection, the requirements for ultra-precise motion are greatly increased. Not only the motion table is required to have nano-level motion positioning accuracy, but also high vacuum, low magnetic flux leakage, and low Fever and other requirements. [0003] The na...

Claims

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Application Information

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IPC IPC(8): G03F7/20H05K9/00
CPCG03F7/70716G03F7/70758G03F7/70808H05K9/0075H05K9/00
Inventor 胡兵江旭初蒋赟
Owner YINGUAN SEMICON TECH CO LTD
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