Method and device for controlling output quantity of semiconductor temperature control device

A technology of temperature control device and control method, which is applied in the direction of temperature control, non-electric variable control, control/regulation system, etc., can solve the problem of large difference between the heating and cooling curve and the calibration process curve, etc.

Active Publication Date: 2021-04-02
BEIJING JINGYI AUTOMATION EQUIP CO LTD
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method and device for controlling the output of a semiconductor temperature control device, which are used to solve the technical problem in the prior art that the temperature rise and fall curves are quite different from the calibration process curves

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for controlling output quantity of semiconductor temperature control device
  • Method and device for controlling output quantity of semiconductor temperature control device
  • Method and device for controlling output quantity of semiconductor temperature control device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039]In order to make the objects, technical solutions, and advantages of the present invention, the technical solutions in the present invention will be described in connection with the drawings of the present invention, and it will be described, and , Not all of the embodiments. Based on the embodiments of the present invention, those of ordinary skill in the art will belong to the scope of the present invention without all other embodiments obtained without creative labor.

[0040]figure 1 It is a flow chart of the control method of the output of the semiconductor temperature control device provided by the present invention, such asfigure 1 As shown, the control method of the output of the semiconductor temperature control device provided by the present invention, including:

[0041]Step 101, decompose the preset temperature reaches the time to multiple equal cycles;

[0042]Step 102, a given output amount of the current cycle is corrected based on the actual instantaneous value of the l...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a method and a device for controlling the output quantity of a semiconductor temperature control device. The method comprises the following steps of: decomposing preset temperature arrival time into a plurality of equal periods; and correcting the given output quantity of the current period based on the actual instantaneous value of the running speed of a previous period andthe given output quantity of the previous period. According to the method and device for controlling the output quantity of the semiconductor temperature control device, the output quantity of the system is controlled according to the temperature rising and falling time, different system characteristics are adapted, the temperature rising and falling time of a heating system and a refrigerating system meets the requirements, and different needed temperature rising and falling time is set corresponding to different temperature intervals; the temperature rising and falling curve of the whole equipment is consistent with the calibration curve of main process equipment.

Description

Technical field[0001]The present invention relates to the field of integrated circuit manufacturing techniques, and more particularly to a control method and apparatus for controlling the amount of semiconductor temperature control device.Background technique[0002]The semiconductor temperature control device provides a steady flow of the main process device in the integrated circuit manufacturing process, a circulating liquid that stabilizes the temperature.[0003]The main process equipment will be used for the first time with the semiconductor temperature control device, which calibrates the lifting temperature curve between the respective temperature points.[0004]Due to the system and capacity difference between the temperature control device of each manufacturer, there is a case where the temperature control device is replaced, and there is a large difference in the difference between the curve and the calibration process.Inventive content[0005]The present invention provides a con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/20
CPCG05D23/20
Inventor 常鑫冯涛宋朝阳李文博董春辉芮守祯何茂栋曹小康
Owner BEIJING JINGYI AUTOMATION EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap