High-quality full-color semiconductor light source

A semiconductor, high-quality technology, applied in the direction of semiconductor devices, electrical solid devices, electrical components, etc., can solve problems such as ineffective excitation of phosphors, low light efficiency of light sources, and decline in product performance, so as to solve the problem of phosphor deposition and improve optical performance. performance and reliability improvement

Pending Publication Date: 2021-04-02
NANJING UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the color temperature of the existing LED lighting source is fixed, and it is mainly concentrated in the range of white light color temperature range or single-color lighting. There is a relative lack of other lighting sources of any color. Therefore, the current mainstream light source can no longer meet the scenes that require specific color lighting.
[0004] In order to obtain any color light source, the principle of LED display can be used for reference and realized by mixing red (R), green (G), and blue (B) chips. Low chromaticity and poor light quality; or it can be realized by exciting red, green, yellow and other phosphor powders through short-wavelength chips, but the light source obtained has low light efficiency and large color difference, and if the phosphor powder is not hardened in time in the packaging glue, it is easy to precipitate to the bottom of the glue, such as figure 1 As shown, the manufacturability is poor, which has not been effectively solved in mass production. In view of the fact that the LED chip emits light from the surface, the phosphor cannot be effectively excited, resulting in a decline in product performance.

Method used

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  • High-quality full-color semiconductor light source
  • High-quality full-color semiconductor light source
  • High-quality full-color semiconductor light source

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The structure of the selected semiconductor light source is a surface-mounted six-pin structure, such as figure 2 As shown, the main components of the light source include LED brackets, LED chips, packaging glue, etc., and the LED chips are selected from the red (R) chip 42 with the vertical structure, the green (G) chip 43 with the horizontal structure and the blue (B) chip with the horizontal structure. Chip 41, fix the three chips on the metal pad 2 of the LED bracket in the order of R-B-G or G-B-R, wherein the R chip is bonded with conductive paste, and the G and B chips are bonded with insulating paste. The wires 5 respectively electrically connect the positive and negative poles of the LED chip with the six pins 3 of the bracket.

[0029] Mix and stir the two-component silicone resin A and B glue in proportion and defoam to obtain transparent packaging glue 6. Take a certain amount of transparent glue and add yellow phosphor with an excitation peak of about 570nm...

Embodiment 2

[0031] The implementation of the light source in this embodiment is based on the evolution of the embodiment 1. The difference from the embodiment 1 is that the R, G, and B chips all adopt a flip-chip structure, and the positive and negative electrodes of the chip and the standoff pins for electrical connections, such as Figure 4 As shown, at the same time, the red phosphor with the excitation peak of 630nm and the green phosphor with 530nm are selected as the phosphor powder. The rest of the implementation forms or processes are performed with reference to Embodiment 1, and will not be repeated here.

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Abstract

The invention discloses a high-quality full-color semiconductor light source. The light source is characterized in that: the semiconductor light source comprises an LED light-emitting unit, an LED support, packaging glue and the like, and the LED light-emitting unit comprises a red-light LED chip, a green-light LED chip and a blue-light LED chip; the LED support comprises a metal bonding pad, pinsand an outer lead frame; and the packaging glue comprises transparent glue and fluorescent powder adding glue. The LED chip is electrically connected with the support pins, then the LED chip is packaged through a two-layer packaging structure with transparent glue arranged on the lower portion and fluorescent powder glue arranged on the upper portion, and the upper surface of the transparent glueis higher than the LED chip. The red chip, the green chip and the blue chip are packaged together, so that a full-color light source can be obtained; meanwhile, fluorescent powder is added for packaging, and the color rendering property can be improved; and on the basis, the two-layer packaging structure is adopted, the excitation failure problem caused by fluorescent powder precipitation can beeffectively solved while the reliability of the light source is improved, and therefore the high-quality full-color light source is obtained.

Description

technical field [0001] The invention relates to a high-quality full-color semiconductor light source, which belongs to the field of semiconductor optoelectronics. Background technique [0002] As the fourth-generation light source, LED semiconductor light source has the characteristics of excellent energy saving, low cost, long life and small size, so it has been widely researched and applied in the fields of lighting and display. In recent years, with the continuous improvement of people's requirements for light quality and the diverse needs for light source selection in different application scenarios, more light colors and high-quality light sources will be needed in the future to meet the growing demand for lighting applications. [0003] The existing mainstream LED lighting sources are mainly prepared by exciting yellow phosphor powder with LED blue light (B) chips. The yellow light (Y) generated by excitation is mixed with the remaining blue light to obtain white light...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/50
CPCH01L25/0753H01L33/48H01L33/502
Inventor 王海波刘晓锋徐誉恒童嘉俊尤宇财蒋腾
Owner NANJING UNIV OF TECH
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