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Adjustable 380-780nm wavelength COB packing technique

A technology of wavelength and technology, applied in the field of COB packaging, can solve problems such as inability to connect branch circuits, achieve the effects of reducing manufacturing processes and costs, improving color rendering, and reducing heat dissipation

Inactive Publication Date: 2013-10-09
江西量一光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This unit does not include a power supply and standard lamp caps and cannot be directly connected to a branch circuit

Method used

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Examples

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Embodiment Construction

[0009] A COB packaging technology that can arbitrarily adjust the wavelength of 380-780nm, characterized in that the packaging structure includes: a plurality of light-emitting chips with a wavelength of 380-780nm are arranged on the substrate, including red light chips, infrared chips, blue light chips, Ultraviolet chip, green chip and yellow chip, the chip also has a color temperature in the range of 2700K to 5700K.

[0010] The COB light source has a color temperature adjustable function, and the Tiger Zenigata LED array has different phosphor strips to provide a small package LED light source with an adjustable color temperature. The ability to adjust the color temperature of white LED lamps is beneficial for many applications. For example, in retail, the color temperature can be changed when a sales display is changed to best display merchandise. In office buildings, hotels and elsewhere, the color temperature can be adjusted throughout the day, making people more comfor...

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PUM

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Abstract

The invention discloses an adjustable 380-780nm wavelength COB packing technique. The packing technique is characterized in that a packing framework of the packing technique is that a plurality of 380-780nm wavelength light-emitting chips including a red light chip, an infrared chip, a blue light chip, an ultraviolet chip, a green light chip and a yellow light chip are arranged on a base material, and the chips further have color temperature in a range between 2700K to 5700K. The adjustable 380-780nm wavelength COB packing technique improves luminous flux, improves light-emitting efficiency, can selectively adjust light-emitting color and color temperature and is suitable for various occasions.

Description

technical field [0001] The invention relates to a COB packaging technology which can adjust the wavelength of 380-780nm arbitrarily. Background technique [0002] LED light source: Composed of one or more LED chips, a PN junction semiconductor device that emits incoherent light radiation when forward biased is called an LED light source. The emitted spectrum may be in the ultraviolet, visible or infrared wavelength region. An LED array or module, an assembly of LED packages (elements) or wafers on a printed wiring board or substrate, possibly with optical components, additional thermal, mechanical and electrical interfaces intended to be connected to the load side of the LED driver. This unit does not contain a power supply and standard lamp caps and cannot be directly connected to a branch circuit. An LED package, an assembly of one or more LED dies including wire bonds or other types of electrical connections, possibly with optical components, thermal, mechanical and el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/50H01L33/48
Inventor 廖昆
Owner 江西量一光电科技有限公司
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