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Trajectory-controlled center-of-gravity adjustable polishing mechanism and polishing method

A trajectory control and polishing mechanism technology, which is applied in the direction of grinding/polishing equipment, manufacturing tools, optical surface grinders, etc., can solve the problems of inability to adjust the magnitude of the applied force, inability to solve online adjustments, etc., to reduce or eliminate the problem of edge effects , Strong practicability, simple control effect

Active Publication Date: 2022-05-24
XIAMEN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, this technology can only change the position of the polishing component through the movable joint, thereby changing the position of the force applied to the polishing disc, but cannot adjust the force applied, let alone solve the purpose of online adjustment according to actual processing requirements

Method used

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  • Trajectory-controlled center-of-gravity adjustable polishing mechanism and polishing method
  • Trajectory-controlled center-of-gravity adjustable polishing mechanism and polishing method
  • Trajectory-controlled center-of-gravity adjustable polishing mechanism and polishing method

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Embodiment Construction

[0031] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0032] The invention discloses a trajectory-controlled adjustable center of gravity polishing mechanism, such as Figure 1-7 shown, is the preferred embodiment of the present invention. The polishing mechanism includes a polishing disc 1 , a power transmission mechanism 2 , a center of gravity adjustment mechanism 3 and a support mechanism 4 . in:

[0033] The polishing pad 13 may be provided at the bottom of the polishing disc 1. Specifically, the polishing pad 13 made of polyurethane or damping cloth may be attached to the bottom surface of the polishing disc 1 as a polishing working surface.

[0034] The power transmission mechanism 2 is used to transmit power to the polishing disc 1. The power transmission mechanism 2 at least includes a motor 21 and a power spindle 22. The lower end of the power spindle 22 is connected to the top...

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Abstract

The invention discloses a track-controlled center-of-gravity adjustable polishing mechanism and a polishing method. The polishing mechanism includes a polishing disc, a power transmission mechanism, a center-of-gravity adjustment mechanism and a supporting mechanism; the power transmission mechanism includes a motor and a power spindle, and the power transmission mechanism A flexible connection is adopted between the main shaft and the polishing disc; the center of gravity adjustment mechanism includes a track plate, a swing plate and a pressing mechanism; the track plate is fixed and has a track groove on it; the swing plate is axially connected to the power spindle In addition, there are projections matching the track grooves on it; the pressure applying mechanism is located between the swing plate and the polishing disc, and is used to transmit the swinging pressure of the swing plate to the polishing disc. The track-controlled center-of-gravity adjustable polishing disc mechanism and polishing method thereof of the present invention can reduce the edge effect by adjusting the center of gravity of the polishing disc by using the track groove of the track plate, and has the advantages of simple operation, strong practicability, automatic control, etc. features.

Description

technical field [0001] The invention belongs to the technical field of optical element finishing, and relates to a polishing tool and a polishing method for precision polishing of an optical element, in particular to a trajectory-controlled adjustable center of gravity polishing mechanism and a polishing method. Background technique [0002] At present in the field of optical component finishing technology, whether it is classical machining or computer-controlled surface forming technology (CCOS), when machining the edge area of ​​the workpiece, due to the reduction of the contact area (because the polishing disc partially protrudes beyond the workpiece), polishing The constant stress increases the contact pressure, which leads to an increase in the removal of the workpiece edge and causes the edge effect phenomenon of "slump". This edge effect will seriously hinder the convergence of the workpiece surface shape error, and even reduce the effective diameter of the workpiece ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B13/01B24B13/00
CPCB24B13/012B24B13/00
Inventor 柯晓龙邱磊
Owner XIAMEN UNIV OF TECH
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