Full-spectrum LED fluorescent powder composition and full-spectrum white-light LED device
A composition and phosphor technology, applied in semiconductor devices, electrical components, luminescent materials, etc., can solve the problems of high proportion of blue light, lack of light, weak luminescence, etc., and achieve the effect of reducing the proportion, uniform distribution, and eliminating the peak of blue light
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[0057] The present invention also provides a method for preparing the above-mentioned LED lamp bead, which specifically includes the following steps:
[0058] Select chip, encapsulant and phosphor;
[0059] After the bracket is cleaned, the bracket is preheated, and then glue compounding, vacuuming, dispensing, hardening, LED lamp bead forming, lamp bead testing, lamp bead sorting and packaging are carried out in sequence.
[0060] see Figure 4 , Figure 4 It is a process flow chart of the preparation method of LED lamp beads.
[0061] In the present invention, the encapsulation glue is selected from silicone rubber or epoxy resin.
[0062] The step of compounding the glue can mix the three kinds of phosphors with the encapsulation glue respectively, and then dispense the glue in turn to form phosphor layers of different colors; or mix the three kinds of phosphors and then mix with the encapsulation glue before dispensing.
[0063] In the present invention, by adjusting t...
Embodiment 1
[0066] Choose a chip with a power of 0.2W, a peak wavelength of 400nm, and a size of 1734 as the first chip, and a chip with a power of 0.2W, a peak wavelength of 450nm, and a size of 0820 as the second chip. The rated luminous flux of the second chip is 5.00lm and 1.25lm respectively, and the blue phosphor Na 3 sc 2 (PO 4 ) 3 :Eu 2+ Accounting for 30% of the total phosphor, the green phosphor Lu 3 Al 5 o 12 : Ce 3+ Accounting for 50% of the total phosphor, red phosphor CaAlSiN 3 :Eu 2+ It accounts for 20% of the total phosphor powder. The ratio of phosphor powder to Dow Corning 6063 silicone rubber is 1.5:1, and the total amount of the mixture of phosphor powder and glue used on each LED device is 0.01 g.
[0067] The optoelectronic performance of the packaged samples was tested using Yuanfang Photochromatic Electricity Comprehensive Test System (PCE-2000A). After testing, the color temperature of the LED device was 2709K, the color rendering index was 98.5, the rat...
Embodiment 2
[0073] Choose a chip with a power of 0.2W, a peak wavelength of 400nm, and a size of 1734 as the first chip, and a chip with a power of 0.2W, a peak wavelength of 450nm, and a size of 0820 as the second chip. The rated luminous flux of the second chip is 4.50lm and 1.50lm respectively, and the phosphor Na 3 sc 2 (PO 4 ) 3 :Eu 2+ Accounting for 16% of the total phosphor, the blue phosphor Sr 4 Al 14 o 25 :Eu 2+ Accounting for 7% of the total phosphor, the blue phosphor Sr 5 (PO 4 ) 3 Cl:Eu 2 + Accounting for 7% of the total phosphor, the green phosphor Lu 3 (Al,Ga) 5 o 12 : Ce 3+ Accounting for 5% of the total phosphor, the green phosphor Lu 3 Al 5 o 12 : Ce 3+ Accounting for 45% of the total phosphor, the red phosphor Sr 2 Si 5 N 8 :Eu 2+ The proportion of the total phosphor is 5.5%, and the red phosphor CaAlSiN 3 :Eu 2+ It accounts for 14.5% of the total phosphor powder. The ratio of phosphor powder and glue is selected as 1.5:1, and the total amount...
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Abstract
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