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laser

A technology of lasers and chips, which is applied in the field of lasers, can solve the problems of large overall errors in laser preparation and low laser alignment, and achieve the effects of reducing overall preparation errors, improving alignment, and avoiding pasting errors

Active Publication Date: 2022-04-26
QINGDAO HISENSE LASER DISPLAY CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0005] The application provides a laser, which can solve the problems of large overall errors in the preparation of the laser and low collimation of the laser emitted by the laser

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Embodiment Construction

[0040] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0041] With the development of optoelectronic technology, lasers are used more and more widely. For example, lasers can be used in welding process, cutting process and laser projection. A laser includes many components, such as a carrier substrate, a heat sink, a prism, and a laser chip, etc., and each component is fixed by pasting or welding. Due to errors in the pasting or welding process of each component, the overall error in the preparation of the final laser is relatively large, and it is difficult for the laser emitted by the laser to achieve a predetermined degree of collimation. The following embodiments of the present application provide a carrier substrate, which can reduce the overall error in the preparation of a las...

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Abstract

The application discloses a laser, which belongs to the field of photoelectric technology. The laser includes: a tube shell, a carrier substrate located in the tube shell, a plurality of laser chips and at least one prism, and the plurality of laser chips and the at least one prism are located on the side of the carrier substrate away from the tube shell; the carrier substrate includes : the chip mounting area where the multiple laser chips are located, and the prism setting area where the at least one prism is located, and the prism setting area is recessed relative to the chip mounting area; each prism corresponds to one or more laser chips, and the prism is located at It corresponds to the light emitting side of the laser chip, and the prism is used to reflect the light emitted by the corresponding laser chip. The present application solves the problem that the overall error of the laser is relatively large, and improves the collimation of the light emitted by the laser. This application is for glowing.

Description

technical field [0001] This application relates to the field of optoelectronic technology, in particular to a laser. Background technique [0002] With the development of optoelectronic technology, lasers are widely used. [0003] The laser may include a tube shell, a carrier substrate, at least one heat sink and at least one laser chip, wherein the carrier substrate is arranged on the tube shell, the at least one heat sink is pasted on the carrier substrate, and each laser chip is pasted on a heat sink . The laser can also include a prism for adjusting the direction of the light emitted by the laser chip, which is usually also attached to the substrate. [0004] Since many pasting steps need to be carried out sequentially in the process of preparing the laser, and there will be pasting errors in each pasting step, therefore, the overall error of the preparation of the laser is relatively large, and the collimation of the laser emitted by the laser is low. Contents of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/0225H01S5/024H01S5/40
CPCH01S5/02469H01S5/4025H01S5/02253H01S5/02326H01S5/02315H01S5/4031H01S5/02255H01S5/02476H01S5/0206
Inventor 周子楠田有良杜光超韩继弘
Owner QINGDAO HISENSE LASER DISPLAY CO LTD
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