Electronic device and assembling method thereof

Abstract

The invention relates to an electronic device and an assembling method thereof. The electronic device comprises a first seat body provided with a plurality of pins, a second seat body and a plurality of coils comprising conducting wires. The assembling method of the electronic device comprises the following steps: installing the coils in the second seat body, and flattening the conducting wires outwards; heating the part, extending out of the second seat body, of the wire, removing the enameled skin of the part through hot melting, exposing a wire core to form a conductive section, then oppositely covering the first seat body and the second seat body, meanwhile enabling the pins to correspondingly fork the wire and penetrate out of the second side wall together, stretching and moving the wire, correspondingly embedding and clamping the conductive sections in the pins, and then welding and combining. The enameled skin is removed through hot melting in advance, the pins fork the wires during covering, and the conductive sections are correspondingly clamped in the pins, so that the wires and the pins can be assembled and combined conveniently and easily, and the welding effect is excellent.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device including several coils and an assembly method of the electronic device. Background technique [0002] An existing electronic device is used for assembling several coils in an electronic seat. Each coil has several wires. The electronic seat has a seat for the coil, several pins inserted at the left and right sides of the seat at intervals, and a cover covering the seat. Each pin has a winding section protruding from the top surface of the base body. [0003] The assembly method of the electronic device is to provide the base body provided with the pins, then put the coil into the base body, and pull the wires to the corresponding pins and wind them around the base. The wire winding section, and then immerse the wire winding section of the pin in the high-temperature molten solder liquid, so that the wire winding section and the wire wound around it are combined tog...

AI Technical Summary

Problems solved by technology

[0004] However, in order to avoid the occurrence of short circuit or open circuit due to loosening of the wires, the above-mentioned assembly method must first manually wind each wire on the corresponding pin during assembly, so the assembly is labor-intensive and time-consuming. inconvenience

In addition, it is also necessary to use a solder liquid with a material different from that of the wires and pins for hot-dip soldering, which will generate a large amount of intermetallic compounds, which will easily cause short circuits or lower reliability, etc., resulting in the failure of the finished product The defect rate has increased, so the above-mentioned electronic devices and their assembly methods still need to be improved

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