Production device and production process of multifunctional chip

Abstract

The invention relates to the technical field of chip production, and discloses a production device and a production process of a multifunctional chip. The production process of the multifunctional chip is completed by cooperation of the production device of the multifunctional chip, and the production device of the multifunctional chip comprises a bottom plate. A positioning mechanism and a U-shaped frame are arranged above the bottom plate, and the U-shaped frame is located above the positioning mechanism. According to the production process of the multifunctional chip, a threaded barrel can move on a rotating shaft and drive a sliding column to move under the guidance of a connecting column through an arranged threaded strip path, then a connecting plate, a fixed column and a second rubber pad clamp a chip body under the action of a first spring, the production process can adapt to chips of different specifications, the applicability is high, and through the arranged rotating shaft, the chip body can be turned over under the guidance of the first bearing, so that the connecting column falls into another supporting frame and another U-shaped frame.

Description

technical field [0001] The invention relates to the technical field of chip production, in particular to a production process for a multifunctional chip and a production device for a multifunctional chip. Background technique [0002] A chip is an integrated circuit, or a microcircuit, a microchip, or a chip. In electronics, a chip is a way of miniaturizing circuits, including semiconductor equipment and passive components, and is often manufactured on the surface of a semiconductor wafer. In general, integrated circuits have two main advantages over discrete transistors: cost and performance. The low cost is due to the fact that the chip has all the components printed as a unit by photolithography, rather than making only one transistor at a time. The high performance is due to the Components switch on and off quickly and consume less energy because the components are small and close to each other. [0003] There are many ways to classify integrated circuits. According to ...

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Problems solved by technology

[0004] The complete process of chip production includes several links such as chip design, wafer production, packaging production and testing. During the process, the chip needs to be turned over to realize the processing of different sides of the chip. At present, when the chip is turned over, it is necessary to manually remove the chip from the clamping device, turn it over and install it on the fixture again. The operation process It is relatively cumbersome, which affects the processing efficiency of chips, and most of the existing fixtures can only hold chips of a single size, which is difficult to adapt to the production of chips of different specifications, resulting in low applicability of the device, and the existing devices have been operated. Usually it is easy to pinch the chip body. Therefore, we propose a production process and device with multifunctional chips

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