Power semiconductor device, method of manufacturing same, and power conversion device
A technology of power semiconductors and semiconductors, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as miniaturization limitations of power semiconductor devices, and achieve the effect of suppressing short circuits
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Embodiment approach 1
[0048] first use Figure 1 to Figure 7 The configuration of the power semiconductor device of this embodiment will be described. In addition, for convenience of description, the X direction, the Y direction, and the Z direction are introduced. Such as Figure 1 to Figure 7 The Z-axis of each graph is shown in the figure 1 The middle and lower side is the positive side of the Z direction, opposite to it, in figure 2 and Figure 7 The upper middle side is the positive side in the Z direction. Also in Figure 5 and Figure 6 , the front side of the page, that is, the upper side in the top view, is the positive side in the Z direction.
[0049] figure 1 It is a schematic cross-sectional view showing a form in which a cooling member is provided in the power semiconductor device according to the first embodiment. figure 2 It is a schematic enlarged perspective view of a portion where a lead member of the power semiconductor device according to Embodiment 1 is extracted. ...
Embodiment approach 2
[0134] Figure 16 It is a schematic cross-sectional view showing a state in which a cooling member is provided in the power semiconductor device according to the second embodiment. Figure 17 It is a schematic enlarged perspective view of a portion where a lead member of the power semiconductor device according to Embodiment 2 is extracted. Figure 18 to show Figure 16 A schematic plan view of the power semiconductor device of , which is turned upside down and mounted on a circuit board. Figure 19 to show Figure 16 A schematic cross-sectional view of the entire form in which the power semiconductor device is mounted on a circuit board. which is Figure 16 , Figure 17 , Figure 18 , Figure 19 Respectively with Embodiment 1 figure 1 , figure 2 , Figure 5 , Figure 7 correspond. Use the following Figure 16 ~ Figure 19 The configuration of the power semiconductor device of the present embodiment will be schematically described.
[0135] refer to Figure 16 ,...
Embodiment approach 3
[0150] Figure 20 It is a schematic cross-sectional view showing one step of the method of manufacturing the power semiconductor device according to the third embodiment. Figure 21 to show Figure 20 A schematic plan view of a power semiconductor device mounted on a circuit board. Figure 22 to show Figure 20 A schematic cross-sectional view of the entire form in which the power semiconductor device is mounted on a circuit board. which is Figure 20 , Figure 21 , Figure 22 Respectively with Embodiment 1 Figure 9 , Figure 5 , Figure 7 correspond. In addition, also in the following description, the same code|symbol is attached|subjected to the same component as Embodiment 1, 2, and when the content overlaps, the description may not be repeated.
[0151] refer to Figure 20 , in the manufacturing method of the power semiconductor device of the present embodiment, basically the same as that of Embodiment 1 is performed. Figure 9 The steps shown are processed in...
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