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Graphene heat conduction and heat dissipation film

A heat-dissipating film, graphene technology, applied in the direction of film/flake adhesives, adhesives, etc., can solve the needs of large electronic products, can not meet the problem of heat generation, etc., to speed up thermal conductivity, easy to paste and remove , the effect of high thermal conductivity

Inactive Publication Date: 2021-04-16
新昌县北联建筑工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The object of the present invention is to provide a graphene heat-dissipating film to solve the problem in the above-mentioned background technology that it cannot meet the use requirements of electronic products with large calorific value

Method used

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  • Graphene heat conduction and heat dissipation film
  • Graphene heat conduction and heat dissipation film
  • Graphene heat conduction and heat dissipation film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1: See Figure 1-6 , a graphene heat dissipation film, comprising a graphene layer 1, a lower copper foil layer 9 and an upper copper foil layer 10, the top of the graphene layer 1 is provided with an upper copper foil layer 10, and the bottom end of the graphene layer 1 is provided with The lower copper foil layer 9 is provided with a sealing and anti-expansion structure 5 between the lower copper foil layer 9 and the outside of the upper copper foil layer 10, and the bottom end of the lower copper foil layer 9 is provided with an auxiliary bonding structure 6, and the outside of the graphene layer 1 Equipped with high thermal conductivity and heat dissipation structure;

[0036] see Figure 1-6 , a graphene heat dissipation film also includes a high heat conduction heat dissipation structure, the high heat conduction heat dissipation structure includes an upper groove 12, the upper groove 12 is arranged inside the top of the graphene layer 1, and the inside o...

Embodiment 2

[0040]Embodiment 2: The sealing and anti-expansion structure 5 is composed of a lower sealing frame 501, an upper sealing frame 502, a joint 503 and a sealant 504. The lower sealing frame 501 is fixedly connected to the outside of the top of the lower copper foil layer 9, and the upper sealing frame 502 is fixedly connected. Outside the bottom end of the upper copper foil layer 10, a connection seam 503 is provided between the lower sealing frame 501 and the upper sealing frame 502, and a sealant 504 is provided inside the connection seam 503;

[0041] The lower sealing frame 501 and the upper sealing frame 502 are equal in size, and the lower sealing frame 501 and the upper sealing frame 502 are fixedly connected by a sealant 504;

[0042] The lower sealing frame 501 and the upper sealing frame 502 are on the same vertical plane;

[0043] Specifically, such as figure 1 , image 3 and Figure 4 As shown, in use, the lower sealing frame 501 and the upper sealing frame 502 ca...

Embodiment 3

[0044] Embodiment 3: The auxiliary sticking structure 6 is composed of a release cardboard 601, a high thermal conductivity silica gel 602, a first tear-off piece 603 and a second tear-off piece 604. The high heat conductivity silica gel 602 is arranged at the bottom of the lower copper foil layer 9, and has a high heat conductivity The bottom end of the silica gel 602 is provided with a release cardboard 601, one side of the release cardboard 601 is fixedly connected with a second tear piece 604, and the first tear piece 603 is fixedly connected with one side of the lower copper foil layer 9;

[0045] The length and width between the release cardboard 601 and the high thermal conductivity silica gel 602 are equal, and the length and width of the high thermal conductivity silica gel 602 and the lower copper foil layer 9 are equal;

[0046] Specifically, such as figure 1 As shown, when in use, pull the first tear-off tab 603, and then tear down the second tear-off tab 604, the ...

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Abstract

The invention discloses a graphene heat conduction and heat dissipation film, and particularly relates to the technical field of graphene heat conduction films. The graphene heat conduction and heat dissipation film comprises a graphene layer, a lower copper foil layer and an upper copper foil layer. The upper copper foil layer is arranged at the top end of the graphene layer, and the lower copper foil layer is arranged at the bottom end of the graphene layer. A first heat conduction silicone grease layer is arranged between the top end of the graphene layer and the bottom end of the upper copper foil layer, and a second heat conduction silicone grease layer is arranged between the bottom end of the graphene layer and the top end of the lower copper foil layer. By arranging a release paper board, high-thermal-conductivity silica gel, a first tearing piece and a second tearing piece, when used, the first tearing piece is pulled, then the second tearing piece is torn downwards, and the second tearing piece can pull down the release paper board from the high-thermal-conductivity silica gel; the graphene heat conduction and heat dissipation film is pasted on a corresponding electronic product through the high-thermal-conductivity silica gel, when the graphene heat conduction and heat dissipation film needs to be removed, only the first tearing piece needs to be torn, the operation is easy, and the application is very convenient.

Description

technical field [0001] The invention relates to the technical field of graphene heat-conducting films, in particular to a graphene heat-conducting and heat-dissipating film. Background technique [0002] In recent years, with the continuous development and progress of science and technology, electronic products have gradually developed towards micro-integration. At the same time, the heating problem of electronic products has become more and more obvious. To solve this problem, a graphene heat conduction and heat dissipation device has been designed and produced. film, the graphene heat dissipation film can be directly pasted on the surface of the electronic product to complete the heat conduction and heat dissipation of the electronic product, which solves the heating problem of the electronic product well, but there are some problems and defects in the existing graphene heat dissipation film . [0003] In the process of realizing the present invention, the inventors have ...

Claims

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Application Information

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IPC IPC(8): C09J7/29C09J7/21C09J7/28
Inventor 杨苗珍何万明张国华
Owner 新昌县北联建筑工程有限公司
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