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Device and method for lengthening pins of original device

A technology of devices and pins, which is applied in the field of semiconductor packaging, can solve the problems of PCB board pins that cannot be wave soldered, increase material costs, and low performance, and achieve the effects of improving product competitiveness, saving time, and reducing thickness

Inactive Publication Date: 2021-04-16
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a device and method for increasing the pins of the original device, which can solve the problem that the pins cannot be wave soldered because the pcb board is too thick, and engineers are looking for substitutes with slightly lower performance, or customizing new materials to increase materials Cost, engineers spend a lot of time going to the warehouse to find matching materials

Method used

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  • Device and method for lengthening pins of original device
  • Device and method for lengthening pins of original device
  • Device and method for lengthening pins of original device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Such as figure 1 and figure 2 , a device for increasing the pin of the original device, including a cylinder 1 and a fin-type buckle 2, the cylinder 1 part includes a concave coincidence area 3 and an extension area 4, the diameter of the cylinder 1 is the same as that of the original device The diameter of the pin 8 is set to be the same, the concave overlapping area 3 is set according to the sphere radius of the chamfering area of ​​the original device pin 8, and the length of the extension area 4 is increased according to the original device pin 8 The length setting of the concave overlapping area 3 in this embodiment is 1.0mm, the thickness of the pcb board is 4.0mm, the length of the original device pin 8 is 2.0mm, and the length of the increased pin exposed board surface is based on the IPC specification. The exposed length is 0.5-2.5mm, and the extension area is calculated to obtain an interval value. The length of the original device pin 8 is L1, the length of...

Embodiment 2

[0032] see Figure 5-Figure 9 , the embodiment of the present invention includes: a method for increasing the pin of the original device, including: opening a pcb according to the device size of the increased original device, and the aperture is 4.0mm;

[0033] When welding the original device, first insert the pin 8 of the original device, and then insert the device for increasing the original device from the back, and the tension after the connecting part 5 is compressed will fix the device for increasing the original device in the hole 8 of the pcb board;

[0034] The pcb board hole 8 is subjected to wave soldering, and the soldering tin welds the original device pin and the device pin of the original device and the pcb board hole 8 into one;

[0035] Conduct electrode test and reliability test on the soldered pins, all of which pass the test.

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Abstract

The invention discloses a device and method for lengthening pins of an original device, and the device comprises a column body and fin-type buckles which are distributed on the side wall of the column body, the original device is connected with wave soldering tin via the column body, and the fin-type buckles act on the inner wall of a pcb hole through tension generated by elastic deformation and are used for connecting the column body with the pcb plate hole. On the premise that the original device is not changed, the welding problem caused by the fact that pins of the original device are too short is solved, the buckle type original device pin lengthening device of different specifications can be designed according to the specifications of the pins of the original device and the lengths of the pins needing to be lengthened, the buckle type original device pin lengthening device is suitable for all short-pin original devices, workers can spent less time finding original devices with long pins, the cost for customizing the long pins is reduced, the space utilization rate is increased by increasing pins in the holes of a pcb, the thickness of a server mainboard is reduced, and the product competitiveness is improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a device and method for increasing pins of an original device. Background technique [0002] With the development of cloud computing applications, informatization has gradually covered all fields of society. People's daily work and life are more and more communicated through the network, the amount of network data is also increasing, and the performance requirements of the server are also higher. The circuit on the PCB board is becoming more and more complex, and the design of the board requires more layers; the power consumption is getting higher and higher, the current density on the board is high, and thicker dielectrics need to be filled between the layers; the mechanism design is complex, and the board It may need to withstand greater stress; in some PCB designs, affected by these factors, the thickness of the board may be very large, sometimes reaching more than 4.0m...

Claims

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Application Information

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IPC IPC(8): H05K1/18H05K3/34
Inventor 孟金鹏
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD