Automatic assembly line for double-heat-conduction-block heat dissipation module

Abstract

The invention relates to an automatic assembly line for a double-heat-conduction-block heat dissipation module. The automatic assembly line comprises a CPU heat conduction block feeding machine, a GPU heat conduction block feeding machine, a left translation machine, a left heat dissipation fin feeding machine, a right heat dissipation fin feeding machine, a heat conduction pipe feeding machine, a machine for dispensing solder paste at two ends of a heat conduction pipe, a left end cover feeding machine, a right end cover feeding machine, an upper cover placing machine, a screw locking machine, a reflow soldering machine, a right translation machine, a cooling machine, a screw loosening machine, an upper cover taking machine and a finished product discharging machine which are sequentially connected end to end, as well as a plurality of carriers which are positioned on the machines and can realize circular conveying. With the automatic assembly line, the heat dissipation module can be fully automatically assembled, only several workers are needed for feeding and discharging, so that the production efficiency is improved, the labor intensity is alleviated, meanwhile, the assembly precision is high, the reject ratio is low, thus the production cost is greatly saved, in addition, the amount of solder paste is easy to control, and the heat dissipation efficiency is guaranteed.

Description

technical field [0001] The invention relates to the field of heat dissipation module assembly, in particular to an automatic assembly line for heat dissipation modules with double heat conduction blocks. Background technique [0002] Cooling modules are widely used in notebook computers to cool the CPU and GPU, such as figure 1 The heat dissipation module with double heat conduction blocks shown includes a heat conduction tube 21, a CPU heat conduction block 22 and a GPU heat conduction block 23 respectively fixed on the heat conduction tube 21 by solder paste, and heat dissipation components respectively fixed on both ends of the heat conduction tube 21 by solder paste. The fins 24 are respectively fixed on the outermost sides of the heat pipe 21 by solder paste to be used to connect the end caps 25 of the motherboard; wherein the CPU heat conduction block 22 and the GPU heat conduction block 23 both include an iron cover 221 for connecting to the motherboard; The heat dis...

AI Technical Summary

Problems solved by technology

[0002] Cooling modules are widely used in notebook computers to cool the CPU and GPU, such as figure 1 The heat dissipation module with double heat conduction blocks shown includes a heat conduction tube 21, a CPU heat conduction block 22 and a GPU heat conduction block 23 respectively fixed on the heat conduction tube 21 by solder paste, and heat dissipation components respectively fixed on both ends of the heat conduction tube 21 by solder paste. The fins 24 are respectively fixed on the outermost sides of the heat pipe 21 by solder paste to be used to connect the end caps 25 of the motherboard; wherein the CPU heat conduction block 22 and the GPU heat conduction block 23 both include an iron cover 221 for connecting to the motherboard; The heat dissipation copper sheet 222 fixed in the iron cover; however, the current heat dissipation modules are assembled manually, and there are the following problems: 1. Because the size of the CPU heat conduction block and GPU heat conduction block, as well as the heat dissipation fins and end caps at both ends are different , requires several or even dozens of workers to assemble, not only the production efficiency is low, but the labor intensity is high, and the assembly accuracy is not easy to guarantee, resulting in a high defect rate, which greatly increases the production cost; 2. The amount of solder paste is not easy to control, too much Too little will affect the cooling efficiency

Images