Method for large-area 3D analysis of samples using glancing incidence FIB milling

Abstract

Methods and apparatuses disclosed herein for large-area 3D analysis of samples using glancing incidence FIB milling. An example method at least includes milling, with a focused ion beam, a sample at a shallow angle and at a plurality of rotational orientations to remove a layer of the sample and to expose a surface, and after milling, imaging, with a charged particle beam, the exposed surface of the sample.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority to U.S. Provisional Patent Application Serial No. 62 / 923,231, filed October 18, 2019. The disclosures of the aforementioned applications are incorporated herein by reference in their entirety. technical field [0003] The present invention relates generally to large area three-dimensional analysis in charged particle microscopy, and in particular to large area three-dimensional analysis in charged particle microscopy using grazing incidence focused ion beam milling. Background technique [0004] Sample volume analysis using charged particle systems is performed using a variety of techniques and charged particle microscopy. However, most of these techniques involve delicate and demanding sample preparation which, if not done correctly, can provide unusable results or destroy critical sample material. For example, conventional slice view techniques use a focused ion beam...

AI Technical Summary

Problems solved by technology

FIB milling may result in the removal of desired areas for imaging if there is no cover, the cover is not strong enough, and / or the alignment is not ideal

Additionally, conventional slice views require time-consuming preparation steps, are limited to high-energy (30 keV) FIB milling, relatively small volumes, require very high cut position accuracy, FIB imaging resolution, and milling artifacts (e.g., "cord ization”), which are common and problematic for subsequent 3D reconstruction

While there are other volumetric analysis techniques that are potentially better than slice view, they have their own drawbacks and difficult sample preparation requirements

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