Rotary liquid jetting device and laser processing device
A spraying device and rotary technology, applied in semiconductor/solid-state device manufacturing, typewriters, printing, etc., can solve problems such as unfavorable gluing or cleaning, and easy damage to conveying pipes, so as to reduce maintenance and cleaning work and improve stability. Effect
Active Publication Date: 2021-04-23
深圳市大族半导体装备科技有限公司
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Problems solved by technology
[0004] The purpose of the embodiments of the present invention is to provide a rotary liquid spraying device, which is used to solve the problem that the delivery pipe of the existing gluing device or cleaning device is easily damaged, which is not conducive to gluing or cleaning, and requires frequent maintenance and timely cleaning. technical problem
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[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention; the terms used in the specification herein are only for the purpose of describing specific embodiments, and are not intended to To limit the invention, for example, the terms "length", "width", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top ", "bottom", "inner", "outer" and other indicated orientations or positions are based on the orientations or positions shown in the drawings, which are only for convenience of description and cannot be understood as limitations on the technical solution.
[0048] The terms "include" and "have" in the specification and claims of the present invention and the description of the above drawings, as well as any variations thereof, are intended to cover a non-exclusive inclusion; The terms "first", "second", etc. are used t...
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The invention belongs to the technical field of laser processing, and relates to a rotary liquid jetting device and a laser processing device. The rotary liquid jetting device comprises a cavity, a hollow rotary platform, a rotary shaft, a swing arm, a nozzle device and a pipeline assembly, wherein the cavity defines an accommodating cavity, the hollow rotary platform is mounted on the cavity and located at the periphery of the cavity, the input end of the rotary shaft is inserted into the hollow rotary platform, the output end of the rotary shaft extends into the accommodating cavity, at least one conveying through hole is formed in the rotary shaft in the axial direction, and a driving device is arranged on the hollow rotary platform; in the accommodating cavity, the swing arm is connected to the output end of the rotary shaft, and the nozzle device is arranged on the swing arm; and under the driving of the driving device, the rotary shaft rotates to drive the swing arm to swing, in the whole swing process, due to the fact that jet liquid is sequentially conveyed into a pipeline assembly and the nozzle device in the cavity along the rotary shaft from an external pipeline, the pipeline assembly makes no contact with the cavity, friction damage can be avoided, maintenance and cleaning work can be reduced, and the whole stability is improved.
Description
technical field [0001] The invention relates to the technical field of laser processing, in particular to a rotary liquid injection device and a laser processing device. Background technique [0002] In the preparation of high-speed electronic components, low-dielectric constant films and copper materials have been gradually used as wafer materials, but these wafers are difficult to cut with ordinary diamond blades. Cutting is usually carried out by laser grooving technology of cold processing. Specifically, the short pulse laser is focused on the wafer surface and then irradiated. The laser pulse is continuously absorbed by the low dielectric constant film, but after absorbing a certain degree of heat energy, the low dielectric constant The film will vaporize instantly, and due to the principle of interaction, the vaporized substance will consume the thermal energy of the wafer, thereby realizing cold processing with slight thermal influence. In order to improve production...
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IPC IPC(8): B41J2/01B41J3/407H01L21/67
Inventor 张伟杨楚风柳啸熊胜亮陈畅王亭入安珂卢红利尹建刚高云峰
Owner 深圳市大族半导体装备科技有限公司