Mixing device for electronic packaging high-thermal-conductivity material

Abstract

The invention relates to the field of electronic packaging material production, particularly to a mixing device for an electronic packaging high-thermal-conductivity material. The mixing device comprises a vertically arranged cambered surface mounting cylinder, wherein a spherical surface mounting cylinder is vertically arranged in the middle of the lower end of the cambered surface mounting cylinder, a support mounting plate is horizontally arranged at the lower end of the spherical surface mounting cylinder, supporting mounting columns are arranged at the four corners of the lower end of the support mounting plate correspondingly, a material guiding mounting groove is formed in the upper end of the support mounting plate and matched with a spherical surface mounting cylinder, a supporting mounting cylinder is vertically arranged over the cambered surface mounting cylinder, and a lifting transmission cylinder is vertically arranged in the supporting mounting cylinder. According to the invention, by matching synchronous transmission with hot melting, mixing and stirring, raw materials can be quickly mixed; by matching with a heat preservation structure, heat loss is reduced, the hot melting efficiency of the raw materials is remarkably improved, and the mixing efficiency and quality are improved; and through lifting adjustment, the device can adapt to mixing of the raw materials of different sizes, the adaptability adjusting performance of the device is remarkably improved, and material guiding is smoother.

Description

technical field [0001] The invention relates to the field of production of electronic packaging materials, in particular to a mixing device for electronic packaging high thermal conductivity materials. Background technique [0002] Electronic packaging is to install the integrated circuit built-in chip for external use. It plays a fixed and sealed role, protects the integrated circuit built-in chip, and enhances the ability to adapt to the environment. The riveting point on the integrated circuit chip is also the contact point, which is welded to the packaged tube shell. On the pins, many electronic packaging materials use ceramics, glass, and metals. Glass raw materials and recycled glass are each pre-measured and charged into a kneading device at a predetermined mixing ratio in order to obtain a glass product having a desired composition. However, when the glass raw material is fixed on the inner wall of the above-mentioned kneading device and the fixed glass raw material...

AI Technical Summary

Problems solved by technology

However, when the glass raw material is fixed on the inner wall of the above-mentioned kneading device and the fixed glass raw material is accidentally peeled off, the above-mentioned mixing ratio will fluctuate compared with the assumed ratio. In the case of glass products manufactured from different substances, there are cases where the desired composition glass product cannot be obtained and becomes a defective product

[0003]Although the current mixing equipment can carry out mixing operations, there are defects in the uniformity and adjustment of mixing, and the mixing guide is not smooth , resulting in unsatisfactory product quality and efficiency

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