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Notebook computer cooling system and method

A notebook computer and heat dissipation system technology, applied in the direction of electrical digital data processing, instruments, digital data processing components, etc., can solve the problems of poor heat dissipation, insufficient release of computer chip performance, etc., and achieve good heat dissipation effect

Pending Publication Date: 2021-04-27
联想长风科技(北京)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] This application provides a cooling system and method for a notebook computer, which is used to solve the technical problem in the prior art that the poor heat dissipation of thin and light notebooks leads to insufficient performance release of computer chips, so as to achieve good heat dissipation for thin and light notebooks, so that the chips of thin and light notebooks The technical effect of fully releasing the performance

Method used

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  • Notebook computer cooling system and method
  • Notebook computer cooling system and method

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Embodiment 1

[0029] Such as figure 1 , figure 2 As shown, the embodiment of the present application provides a notebook computer heat dissipation system, which includes: a cooling module 100 having a first accommodating space inside, wherein a first side of the cooling module 100 is opened There are a first opening and a second opening;

[0030]Specifically, the cooling module 100 is a core module for realizing heat dissipation of the notebook computer, and the cooling module 100 has a first accommodating space, and the first accommodating space is configured to provide power for the cooling module 100 A device and a storage device for cooling liquid; a first opening and a second opening are provided on the first side of the cooling module 100 .

[0031] Further, the notebook computer cooling system further includes: a first connecting water pipe 200, one end of the first connecting water pipe 200 is fixedly connected to the cooling module 100 through the first opening; a second connect...

Embodiment 2

[0040] The present application also provides a notebook computer heat dissipation method, the method is applied to a heat dissipation system, and the heat dissipation system has a cooling module, a first connecting water pipe, a second connecting water pipe, and a water cooling plate module, including:

[0041] Step 100: opening the first hatch installed on the bottom case of the first notebook computer;

[0042] Step 200: Install the water cooling plate module in the first notebook computer through the first connecting piece, so that the water cooling plate module is attached to the chip of the first notebook computer;

[0043] Step 300: Turn on the water pump in the cooling module, so that the cooling system starts to work;

[0044] Step 400: The heat generated during the operation of the chip is transferred to the water-cooled plate module, and the temperature of the chip is cooled through the first connecting water pipe, the second connecting water pipe, and the cooling mo...

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Abstract

The invention discloses a notebook computer cooling system and method, and the system comprises: a cooling module which is internally provided with a first accommodation space, and a first side surface of the cooling module is provided with a first hole and a second hole; the first connecting water pipe, one end of which penetrates through the first open hole and is fixedly connected with the cooling module; the second connecting water pipe, one end of which penetrates through the second opening to be fixedly connected with the cooling module; the water cooling plate module that is connected with the end, away from the cooling module, of the first connecting water pipe and the end, away from the cooling module, of the second connecting water pipe, wherein the water cooling plate module is installed in the notebook computer through a first connecting piece, the water cooling plate module is attached to a chip, and water cooling circulation is achieved through the water cooling plate module, the connecting water pipe and the cooling module, so that the chip is cooled through the water cooling circulation.

Description

technical field [0001] The invention relates to the technical field related to heat dissipation of electronic equipment, in particular to a heat dissipation system and method for a notebook computer. Background technique [0002] The design trend of notebook computers is that the thickness is getting thinner and thinner, the weight is getting lighter and the power is getting higher and higher. Contradictory to this is the thermal design. Because the ability to dissipate heat is directly proportional to the space, solving the heat dissipation problem in a small space has increasingly become a challenge for the entire electronics industry. The reduction of space means that the heat dissipation area will be compressed, or the passage of air in and out will be reduced, and the air volume will be reduced. In mainstream consumer notebooks, the problem of insufficient performance release is very prominent. The products that are currently on the market are all configurations that...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/16
CPCG06F1/203G06F1/1613
Inventor 叶剑文
Owner 联想长风科技(北京)有限公司
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