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Tin layer high-temperature-discoloration-resistant composition

A color-changing composition, high-temperature resistant technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc.

Pending Publication Date: 2021-04-30
HUZHOU TEACHERS COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above-mentioned problems, the present invention provides a tin layer anti-high temperature discoloration composition, which introduces a polymer of gamma-methacryloxypropyltrimethoxysilane as a monomer as a key component , effectively avoid the discoloration of the tin layer at high temperature

Method used

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  • Tin layer high-temperature-discoloration-resistant composition
  • Tin layer high-temperature-discoloration-resistant composition
  • Tin layer high-temperature-discoloration-resistant composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] This example provides a polymer of γ-methacryloxypropyltrimethoxysilane as a monomer, its structural formula is shown in Table 1, and its synthetic route is as follows:

[0021]

[0022] Table 1: Polymer structural formula that embodiment 1 provides

[0023]

[0024] Preparation method of polymer P1

[0025] Under nitrogen protection, γ-methacryloxypropyltrimethoxysilane (24.81g, 100mmol), azobisisobutyronitrile AIBN (82.1mg, 0.5mmol), absolute ethanol (100mL) were added to In the two-necked flask, heat up to 70°C (can be any value in 60-80°C) and react for 12h (can be any value in 8-24h). The reaction solution was naturally cooled to room temperature. Anhydrous ethanol was distilled off under reduced pressure to obtain polymer P1. 1 H NMR (400MHz, CDCl 3 )δ(ppm): 4.06(t, 2H), 3.55(s, 9H), 2.13(br, 1H), 1.60-1.53(br, 4H), 0.58(t, 2H).

Embodiment 2

[0027] The configuration of the tin layer anti-high temperature discoloration composition is as follows:

[0028] Using isopropanol as a solvent, the polymer P1 of Example 1 was added in an amount of 8%, stirred evenly at room temperature, and dissolved completely.

Embodiment 3

[0030] Soak the tin layer anti-discoloration composition of the tin layer involved in Example 2 at room temperature for 10 seconds on the tin-plated layer of the lead frame, and then perform a reflow soldering application assessment test after three-stage countercurrent washing. The process is as follows:

[0031] a. Preheating, the temperature rises from room temperature to 150°C, the temperature rise rate is controlled at about 2°C / s, and the time in this temperature zone is 60-150s.

[0032] b. Uniform temperature, the temperature is from 150-217°C, and the temperature rises steadily and slowly, and the temperature rise rate is less than 1°C / s.

[0033] c. Reflux, the temperature is controlled at 217°C for 60-90s.

[0034] d. Cooling, the maximum temperature drop rate cannot exceed 4°C / s, and observe the application effect with the naked eye after cooling to room temperature.

[0035] After the lead frame tin plating layer treated with the tin layer anti-high temperature d...

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Abstract

The invention discloses a tin layer high-temperature-discoloration-resistant composition. According to the composition, gamma-methacryloxy propyl trimethoxy silane is used as a polymer of a monomer. The tin layer high-temperature-discoloration-resistant composition is especially suitable for a lead frame electrotinning process, and can effectively avoid the high-temperature discoloration phenomenon of a tin coating.

Description

technical field [0001] The invention relates to a tin layer anti-high temperature discoloration composition, in particular, the composition introduces a polymer of gamma-methacryloxypropyltrimethoxysilane as a monomer as a key component. The method is preferably used in the tin plating process of the lead frame, and can effectively avoid discoloration of the tin plating layer at high temperature. The invention belongs to the field of traditional packaging and processing of semiconductors. Background technique [0002] In the lead frame tinning process in the traditional packaging process, in order to make the pins solderable, the tinning process is required. However, in the post-baking or welding process after electroplating tin, since the high temperature environment is likely to cause oxidation and discoloration of the tin layer, resulting in a decrease in solderability, it is particularly important to treat the tin layer with anti-high temperature discoloration treatment...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F130/08C25D5/48H01L21/48
CPCC08F130/08C25D5/48H01L21/4821
Inventor 王坤燕张玉建唐培松郭玉华沈强王永亚潘国祥曹枫杨圣晨
Owner HUZHOU TEACHERS COLLEGE
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