Wafer expanding device, wafer expanding apparatus and wafer processing method

Abstract

The invention discloses a wafer expanding device, a wafer expanding apparatus and a wafer processing method, and the wafer expanding device comprises a first fixed ring which is fixedly connected with a first thin film, wherein the first thin film at least covers an area surrounded by an inner ring of the first fixed ring, and a bearing area of the first thin film is used for bearing a wafer; and a second fixed ring which is located on the first fixed ring and is fixedly connected with a second thin film, wherein the second thin film is provided with a hollowed-out area and an extending part, and the hollowed-out area is opposite to the bearing area of the first thin film, and the first thin film is extended, so that the bearing area moves along the direction from the first fixed ring to the second fixed ring, and the extending parts of the first film and the second film are contacted and fixed. According to the wafer expanding device, the extended first thin film is fixed by the second thin film, and a mode of fixing the thin film by using a wafer expanding ring is replaced, so that the stability of fixing the first thin film is improved.

Description

technical field [0001] The invention relates to the field of semiconductor device manufacturing, and more specifically, to a crystal expansion device, crystal expansion equipment and a wafer processing method. Background technique [0002] In the manufacturing process of semiconductor devices, operations such as detection and sorting are performed on the separated chips on the wafer after the wafer dicing step. In order to facilitate the detection and sorting operations, it is necessary to perform wafer expansion operations on the wafer. Specifically, the distance between each chip is enlarged by extending the film used to carry the wafer. After the film is stretched, two inner and outer plastic expansion rings are used to clamp and fix the stretched film, and the excess film is cut. [0003] However, in the case of using two inner and outer crystal expansion rings to clamp and fix the film, once the crystal expansion ring deforms, it is very easy to cause the film to fall o...

AI Technical Summary

Problems solved by technology

[0003] However, in the case of using two inner and outer crystal expansion rings to clamp and fix the film, once the crystal expansion ring deforms, it is very easy to cause the film to fall off partially or completely from between the two crystal expansion rings, so that each film will shrink due to film shrinkage. The problem of uneven spacing between chips is not conducive to the subsequent operation of chips

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