Multilayer flexible substrate packaging method and packaging structure

Abstract

The invention provides a multilayer flexible substrate packaging method and packaging structure. The method comprises the following steps: forming a substrate stacking structure which is provided with a plurality of stacked flexible substrates, wherein each flexible substrate comprises a flexible material substrate, a device disposed on the flexible material substrate, and a lead layer connected with the device; and enabling the lead layer to extend to the edge of the flexible material substrate; processing the side wall, arranged along the stacking direction of the flexible substrate, of the substrate stacking structure so as to expose the lead layer; and forming a side wall connecting layer on the side wall, and connecting the side wall connecting layer with the lead layer. According to the multilayer flexible substrate packaging method, the stability and reliability of the multilayer flexible substrate packaging structure are improved, and meanwhile, the technical difficulty is also reduced.

Description

technical field [0001] The invention relates to the technical field of flexible electronics, and in particular to a multilayer flexible substrate packaging method and packaging structure. Background technique [0002] As flexible electronics that will lead the next generation of electronic revolution, it will be widely used in electronic communication, medical and military fields. With the continuous development of flexible electronics, high-density and three-dimensional interconnection will be the mainstream of the next stage of development. [0003] At present, flexible electronic packaging technology has been borrowed and integrated with traditional semiconductor packaging technology. For example, in the multilayer flexible substrate packaging structure, the through-hole interconnection process has been used in the interlayer interconnection of flexible substrates. Such as figure 1 As shown, through-hole interconnection is achieved by disposing metal vias 110 in through...

AI Technical Summary

Problems solved by technology

like figure 1 As shown, through-hole interconnection is achieved by setting metal vias 110 in through-holes 100 to achieve electrical interconnection between layers, but this method cannot be used in flexible packaging structures with high bending

like figure 2 As shown, when the flexible substrate is bent to a large extent, because the metal vias 110 are generally less flexible and cannot be stretched, bending at a large angle may easily cause problems such as peeling and fracture of the metal vias 110 in the through hole 100. Therefore, the existing traditional through-hole metallization process has its shortcomings that cannot be ignored in flexible interconnection.

[0004] Under the demand of high-density, multi-layer wiring substrates, such as image 3 As shown, if the through-hole interconnection process is still used in the flexible substrate, the number of through-holes 100 between flexible device layers will increase day by day, and the high-density metal vias 110 will seriously damage the flexibility of the entire flexible device.

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