Printed circuit board production and processing method

Abstract

The invention discloses a printed circuit board production and processing method in the technical field of printed circuit board production and processing. The printed circuit board production and processing method comprises the following steps of: step 1, cutting a printed circuit board into a required shape; 2, placing the printed circuit board on a clamping device, and starting equipment to use the clamping device to clamp the printed circuit board according to any shape of the circuit board; 3, printing the circuit board by using a drill bit; 4, starting a clamping device to release the circuit board; and 5, taking down the printed circuit board from the clamping device. The problems that electronic devices on the printed circuit board are heated, fixed target objects are obviously inconsistent, hole sites are fixed, deformation of the printed circuit board is aggravated if things go on like this, the welding stability of the electronic parts is reduced, and the printed circuit boards are different in shape, so that other irregular printed circuit boards cannot be well adapted to clamping, and printing fails due to offset in the later printing process are solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for producing and processing printed circuit boards. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. After electronic equipment adopts printed boards, due to the consistency of similar printed boards, errors in manual wiring are avoided, and automatic insertion or placement of electronic components, automatic soldering, and automatic detection can be realized to ensure the quality of electronic equipment. , Improve labor productivity, reduce costs, and facilitate maintenance. [0003] In the prior art, most printed circuit boards are fixed by...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a printed circuit board production and processing method to solve the above-mentioned background technology that the printed circuit board is fixed by holes on the circuit board. The base material of the object is different, and the elongation is not considered, so the coefficient of thermal expansion is different. When the machine is working, the electronic devices on the printed circuit board will heat up, and the fixed target object is obviously inconsistent, and the hole position is fixed. The deformation of the circuit board is aggravated, and the welding stability of electronic parts is reduced; secondly, the printed circuit board generally needs to be fixed on a platform during the welding process to facilitate the welding operation, but the shapes of the printed circuit boards are different, and the usual printed circuit boards There are various shapes with straight sides and curved sides. The traditional printed circuit board fixing platform has only two straight side clamps, and does not have the height lifting function, so it cannot be well adapted to other irregular printed circuit boards. If the circuit board is too large, the components on the circuit board will easily rub against the desktop, which will easily cause wear and tear on the components. When the circuit board is too small, the circuit board is not easy to fix, it is inconvenient to hold, and it is easy to move during welding, which brings certain difficulties to the fixing and operation of the printed circuit board in the actual assembly process

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