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Circuit board welding forming device

A soldering forming and circuit board technology, which is applied in the direction of circuit board tool positioning, printed circuit, printed circuit manufacturing, etc., can solve the problem that the pins are easy to scratch the staff, so as to reduce the possibility of being scratched and facilitate clamping Fixed, easy-to-place and generalized effects

Active Publication Date: 2021-04-30
永康市质量技术监测研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The object of the present invention is to provide a circuit board welding and forming device to solve the problem that the pins of the components on the circuit board are relatively sharp and easy to scratch the staff in the above-mentioned background technology

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1: See Figure 1-6 , a circuit board welding and forming device, comprising legs 1 and a base 2, two sets of legs 1 are fixedly connected to both sides of the bottom of the base 2, two sets of columns 3 are fixedly connected to both sides of the top of the base 2, and two sets of columns 3 are fixedly connected to the top of the base 2 One side is fixedly connected with an inductive structure 4, between the uprights 3 is fixedly connected with a placement structure 8, one side of the uprights 3 is fixedly connected with a protective structure 9, the other side of the top of the base 2 is fixedly connected with a fixed structure 10, one of the uprights 3 The side is fixedly connected with a grinding mechanism;

[0036] see Figure 1-6 , a circuit board welding forming device also includes a grinding mechanism, the grinding mechanism includes a grinding box 5, the grinding box 5 is fixedly connected to one side of the column 3, and the inside of the grinding box 5 ...

Embodiment 2

[0039] Embodiment 2: induction structure 4 is made up of induction box 401, first induction plate 402, first groove 403, second induction plate 404, third induction plate 405, second groove 406 and third groove 407, induction The box 401 is fixedly connected to one side of the top of the base 2, and the top inside the summarizing box 401 is movably connected with a first summarizing plate 402, the top of the first summarizing plate 402 is provided with a first groove 403, and the bottom of the first summarizing plate 402 is provided with There is a second induction plate 404, the top of the second induction plate 404 is provided with a second groove 406, the bottom of the second induction plate 404 is provided with a third induction plate 405, and the top of the third induction plate 405 is provided with a third groove 407;

[0040] The first induction board 402, the second induction board 404 and the third induction board 405 are flexibly connected inside the induction box 40...

Embodiment 3

[0042] Embodiment 3: The placement structure 8 is composed of a cross bar 801, a sleeve block 802, a connecting rod 803, a silicone pad 804 and a bottom plate 805. The cross bar 801 is fixedly connected between the upright columns 3, and the external movable sleeve of the cross bar 801 has three sets of sleeves. Block 802, two sets of connecting rods 803 are fixedly connected to the bottom of the cover block 802, a base plate 805 is fixedly connected between the connecting rods 803, and a silicone pad 804 is fixedly connected to the top of the base plate 805;

[0043] The width inside the block 802 is greater than the width outside the crossbar 801, and the crossbar 801 is embedded inside the block 802;

[0044] Specifically, such as figure 1 and Figure 4 As shown, the soldered circuit board contains some wet tin. At this time, directly collecting the circuit board will easily cause the tin on the circuit board to fall off. The circuit board can be placed on the bottom plate...

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Abstract

The invention discloses a circuit board welding forming device, and particularly relates to the technical field of circuit board processing, the circuit board welding forming device comprises support legs and a base, and two groups of support legs are fixedly connected to two sides of the bottom end of the base. By arranging a polishing box, a driving motor, a polishing disc, a first cavity, a connecting shaft, a second cavity, a collecting box and a handle, the surfaces of pins on the back face of a welded circuit board are sharp, skin is prone to being scratched, the polishing disc is installed on one side of the device, and the driving motor drives the polishing disc to polish the pins on the back face of the circuit board, chippings generated after polishing directly fall into the collecting box at the bottom end of the second cavity, after the collecting box collects the chippings for a period of time, the collecting box can be pulled out from the interior of the polishing box through the handle to be cleaned, cleaning and polishing of pins on the back face of the circuit board are achieved through the mechanism, the possibility that workers are scratched is reduced, and meanwhile, the welding processing of the circuit board becomes more efficient.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board welding and forming device. Background technique [0002] Circuit boards are also called PCB boards. In recent years, circuit boards have been used more and more widely. In the process of making circuit boards, components need to be welded on the surface of the device. There are still some shortcomings in the use of existing circuit board welding devices, such as After the circuit board is soldered, the leads of the components are directly cut, resulting in a sharp surface that is easy to scratch the staff, or the components that make up the circuit board are small in size, which is not easy to place and find during soldering and installation. During the soldering process, due to The welding head has a high temperature and is exposed to the outside, which can easily cause burns to users. [0003] In the process of realizing the present invention,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H05K3/00
CPCH05K3/341H05K3/0044H05K3/0008
Inventor 胡帅徐健康耿童昱朱正兵李垚磊周梦幽杨仲辉
Owner 永康市质量技术监测研究院