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Printed circuit board repair station

A technology for printed circuit boards and maintenance stations, which is applied in the fields of printed circuit maintenance/correction, printed circuit secondary processing, workbench, etc. It can solve problems such as poor quality of circuit boards, achieve volume reduction, avoid air bubbles, and improve The effect of product quality

Active Publication Date: 2022-06-17
CHONGQING FOUNDER HI TECH ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a printed circuit board maintenance station, which is used to solve the problem that in the prior art, due to the small diameter of the via hole, it is easy to get between the resin oil and the resin in the via hole during the process of dripping the resin oil. Formation of air bubbles, leading to technical problems with poor quality circuit boards

Method used

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  • Printed circuit board repair station
  • Printed circuit board repair station
  • Printed circuit board repair station

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Embodiment Construction

[0046] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. The embodiments described below and features in the embodiments may be combined with each other without conflict.

[0047] In the present invention, unless otherwise expressly specified, the terms "installation", "connection", "connection", "fixing" and other terms should be understood in a broad sense, for example, it may be a fixed ...

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PUM

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Abstract

An embodiment of the present invention provides a printed circuit board maintenance platform, including a workbench and a heating device, wherein the upper surface of the workbench is used to hold a printed circuit board, and the heating device heats a preset area of ​​the printed circuit board, The preset area contains via holes, and the interior of the via holes is filled with resin, and the surface of the resin has depressions. When in use, keep the depression of the resin upward and heat it, the resin in the via hole will soften and expand outward, thereby reducing the volume of the depression on the surface of the resin, drop the resin above the resin in the via hole, and cool During the process, the resin in the via hole shrinks inward, and then gradually sucks the resin on the printed circuit board outside the via hole into the via hole, reducing the volume of the depression when the resin is dripped in, thereby avoiding the resin in the via hole when dripping the resin. Air bubbles are generated between the resin and the dripped resin, which improves the product quality.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a printed circuit board inspection stand. Background technique [0002] The printed circuit board is the support body of the electronic components and the carrier of the electrical connection of the electronic components. Via holes with different diameters are arranged on the printed circuit board, so that the electrical connection lines on the printed circuit board can be connected between layers. In the actual production process, the via holes of the printed circuit board need to be plugged. , so how to plug the vias on the printed circuit board has become a research hotspot. [0003] In the related art, plugging is generally performed by filling resin oil into the via holes. Specifically, the resin oil is heated, and then the resin oil is dropped into the via hole, and the via hole can be filled after the resin oil is cooled. [0004] However, du...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22B25H1/02B25H1/12
CPCH05K3/225B25H1/02B25H1/12
Inventor 黄云钟曹磊磊孙玉凯何为张胜涛张伟华
Owner CHONGQING FOUNDER HI TECH ELECTRONICS