Chip packaging structure, preparation method of chip packaging structure and display screen
A technology of chip packaging structure and chip body, which is used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of short circuit of bump structure, reduced distance, and ACF glue is easily squeezed, so as to improve packaging quality, the effect of avoiding short circuits
Pending Publication Date: 2021-05-14
CHIPMORE TECH CORP LTD +1
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Problems solved by technology
[0004] Since the conductive particles in the ACF glue are evenly distributed between the entire driver IC chip and the entire ITO substrate, as the distance between the driver IC chip and the ITO substrate decreases, the distance between two adjacent bump structures ( Gap) becomes smaller, and ACF glue is easily squeezed between two adjacent bump structures, which may cause a short circuit between two adjacent bump structures
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[0052] The terms "first", "second", "third" and so on are only used for distinguishing descriptions, and do not represent sequence numbers, nor can they be understood as indicating or implying relative importance.
[0053] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", and it does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0054] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "inner", "outer", "left", "right", "upper", "lower" etc. are based on the Orientation or positional relationship, or the orientation or positional relationship that the application product is usually placed in use, is only for the convenience of des...
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The invention relates to a chip packaging structure, a preparation method of the chip packaging structure and a display screen, the chip packaging structure comprises a chip body and at least one packaging bump, and the packaging bump is arranged on the chip body; wherein the packaging bump is made of metal, and the surface, deviating from the chip body, of the packaging bump is a plane. According to the chip packaging structure, the surface, away from the chip body, of the packaging convex block is set to be the plane, the chip packaging structure is welded to the conductive substrate through the packaging convex block, and the chip packaging structure is in conductive connection with the conductive substrate directly through the packaging bump made of the metal material, so that conductive connection does not need to be carried out by using ACF glue additionally; the packaging quality of the chip body and the conductive substrate is improved, and short circuit between two adjacent packaging bumps is avoided as much as possible.
Description
technical field [0001] The present application relates to the technical field of chip packaging, in particular, to a chip packaging structure, a method for preparing the chip packaging structure, and a display screen. Background technique [0002] Liquid Crystal Display (LCD) display screens are becoming thinner and lighter, and it has become a trend to reduce the size of LCD by directly binding the driver chip (Chip On Glass, COG) technology on the glass. , which are widely used in communication terminals, MP3 and other portable electronic devices. [0003] In the prior art, the metal bump (bump structure) used for packaging on the driver IC chip is made of one material, and the lamination of the driver IC chip and the ITO substrate mainly depends on ACF glue (Anisotropic Conductive Film, Anisotropic Conductive Film) Film) realized. [0004] Since the conductive particles in the ACF glue are evenly distributed between the entire driver IC chip and the entire ITO substrate...
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IPC IPC(8): H01L23/488H01L21/60
CPCH01L24/11H01L24/13H01L24/81H01L2224/111H01L2224/13018H01L2224/8134
Inventor 梅嬿
Owner CHIPMORE TECH CORP LTD