Full-automatic IC pin shaping equipment

Abstract

The invention discloses full-automatic IC pin shaping equipment. The equipment comprises a main transmission mechanism arranged below a working table, a track cam mechanism and a feeding cam mechanism, the track cam mechanism and the feeding cam mechanism are driven by a main transmission shaft of the main transmission mechanism, the track cam mechanism penetrates through the working table to support a feeding track, and when the main transmission shaft rotates to drive the feeding track to move upwards, the feeding cam mechanism drives material pieces on the feeding track to move in the feeding direction. According to the equipment, power is concentrated, one main transmission shaft drives the track cam mechanism, the feeding cam mechanism and a stamping mechanism to act at the same time to carry out feeding, stamping and cutting on the material pieces, a position sensor or other electronic sensors do not need to be arranged to be matched for transmission control, and control errors and control deviation are effectively prevented; power concentration can reduce the arrangement of power assemblies, reduce the equipment cost and the equipment size, and improve the production efficiency; and a plurality of overload protection air cylinders are arranged for buffering, so that the equipment is prevented from being damaged due to overload.

Description

technical field [0001] The invention relates to the field of package manufacturing, in particular to a fully automatic IC pin shaping device. Background technique [0002] Packaging technology is a technology that packages semiconductor integrated circuit chips with insulating plastic or ceramic materials. Packaging technology packaging is necessary and crucial for chips. Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip and causing electrical performance degradation. On the other hand, the packaged chip is also easier to install and transport. [0003] The power for pressing down the mold, the power for conveying the lead bracket on the track, and the power for lifting the track in the existing pin shaping equipment are separated, so it is necessary to use various sensors for position sensing, and then cooperate with each motor action , to complete the entire feeding, stamping and cutting steps, but the electr...

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Problems solved by technology

[0003] The power for pressing down the mold, the power for transporting the lead bracket on the track, and the power for lifting the track in the existing pin shaping equipment are separated, so it is necessary to use various sensors for position sensing, and then cooperate with each motor action , to complete the entire feeding, stamping and cutting steps, but the electronic sensor often has a certain error in sensing, which is likely to cause uncoordinated equipment movements, resulting in difficulty in debugging and unstable production process, which is prone to waste.

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