Bonding material for abrasive block backboard and friction body of high-speed electrical multiple unit as well as preparation method and application thereof
A high-speed EMU and bonding material technology, applied in the field of materials, can solve problems such as poor affinity performance and low resin content
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Embodiment 1
[0016] In the material of the abrasive metal back plate and the friction body of the present embodiment, each component and its weight percentage relative to the total weight of the bonding material are: 20% epoxy resin, 10% polyimide resin, nanometer CaCO 3 30%, barium sulfate 15%, carbon fiber 15%, aramid fiber 5%, carbon black 5%.
[0017] The preparation method is to add the above-mentioned raw materials into the coulter type mixer step by step according to the proportion. After mixing for 20 minutes, the required bonding material can be obtained. The weight ratio is put into the mold cavity in layers, and the pressing is started after putting the metal back plate. The pressing temperature is 140°C, and the pressing pressure is 20MPa, and the grinding wheel with high back plate bonding strength can be obtained.
[0018] The performance of the grinding wheel prepared in this embodiment is tested, and the test method and results are as follows.
[0019] The test was carried...
Embodiment 2
[0021] Each component in the grinding sub-bonding material of the present embodiment and its weight percentage relative to the total weight of the grinding sub-bonding material are: epoxy resin 16.5%, polyimide resin 15%, nanometer SiO 2 27.5%, barium sulfate 15%, carbon fiber 20%, aramid fiber 4%, carbon black 2%.
[0022]The preparation method is to add the above-mentioned raw materials into the coulter type mixer step by step according to the proportion. After mixing for 20 minutes, the required bonding material can be obtained. Put the layer into the mold cavity, put it into the metal back plate and start pressing. The pressing temperature is 150 ° C and the pressing pressure is 10 MPa, so that the grinding wheel with high back plate bonding strength can be obtained.
[0023] The performance of the grinding wheel prepared in this embodiment is tested, and the test method and results are as follows.
[0024] According to the test method of UIC 541-4-2010 "Braking-Braking a...
Embodiment 3
[0026] Each component in the abrasive bonding material of the present embodiment and its weight percentage relative to the total weight of the abrasive bonding material are: epoxy resin 17%, polyimide resin 16%, nanometer CaCO 3 15%, nano-SiO 2 15%, barium sulfate 10%, carbon fiber 10%, aramid fiber 10%, carbon black 7%.
[0027] The preparation method is to add the above-mentioned raw materials into the coulter type mixer step by step according to the proportion. After mixing for 20 minutes, the required bonding material can be obtained. Put the layer into the mold cavity, put it into the metal back plate and start pressing. The pressing temperature is 165 ° C and the pressing pressure is 8 MPa, so that the grinding wheel with high back plate bonding strength can be obtained.
[0028] The performance of the grinding wheel prepared in this embodiment is tested, and the test method and results are as follows.
[0029] The test was carried out according to the test method of U...
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Abstract
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