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Multi-group symmetrical array high-power optical fiber coupling semiconductor laser packaging structure and method

A symmetrical array and fiber coupling technology, which is applied in the direction of semiconductor laser devices, semiconductor lasers, laser devices, etc., can solve the problems of complex installation and adjustment of lasers and difficulties in industrial applications, so as to improve the quality of light sources, avoid uneven heat dissipation, and increase output power Effect

Pending Publication Date: 2021-06-01
Shandong Huaguang Optoelectronics Co. Ltd.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The installation and adjustment of the laser is more complicated, the industrial application is more difficult, and the possibility of mutual interference in the laser transmission process cannot be avoided

Method used

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  • Multi-group symmetrical array high-power optical fiber coupling semiconductor laser packaging structure and method
  • Multi-group symmetrical array high-power optical fiber coupling semiconductor laser packaging structure and method
  • Multi-group symmetrical array high-power optical fiber coupling semiconductor laser packaging structure and method

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Effect test

Embodiment 1

[0041] Embodiment 1: as Figure 1-2 As shown, this embodiment provides a multi-group symmetrical array high-power fiber-coupled semiconductor laser packaging structure, including a housing 3, an R-type single-group laser 1, an L-type single-group laser 2, a polarization beam combiner 4 and a fiber coupling device, of which,

[0042] The housing 3 is a cuboid, one side of the cuboid is provided with a groove 12, and one side of the lower surface of the groove 12 is provided with a step 13, and the housing structure is as follows: Figure 7-8 As shown, the two ends of the upper surface of the step 13 are respectively provided with an R-type single-group laser 1 and an L-type single-group laser 2, and the lower surface of the groove 12 in front of the step 13 is provided with a polarization beam combiner 4, and the lower surface of the groove 12 is another A fiber optic coupler is arranged on the casing 3 on one side.

[0043] The R-type single-group laser 1 includes a base plate...

Embodiment 2

[0053] Embodiment 2: A high-power fiber-coupled semiconductor laser packaging structure with multiple groups of symmetrical arrays, the structure is as described in Embodiment 1, the difference is that the shape of the groove 12 is a cuboid, and one side of the lower surface of the groove 12 is set There are 4 sets of steps.

Embodiment 3

[0054] Embodiment 3: A high-power fiber-coupled semiconductor laser packaging structure with multiple groups of symmetrical arrays, the structure is as described in Embodiment 1, the difference is that the fiber coupler includes a coupling lens 5, a fixing seat 6 and an optical fiber assembly 7, and the coupling The lens 5 is assembled on one end of the fixing base 6 , the fiber assembly 7 is assembled on the other end of the fixing base 6 , the fixing base 6 is assembled on the housing 3 , the coupling lens 5 is inside the housing 3 , and the optical fiber assembly 7 is outside the housing 3 .

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Abstract

The invention relates to a multi-group symmetrical array high-power optical fiber coupling semiconductor laser packaging structure and method, and belongs to the technical field of semiconductor laser packaging. The structure comprises a shell, an R-type single-group laser, an L-type single-group laser, a polarization beam combiner and an optical fiber coupler, the shell is a cuboid, one side of the cuboid is provided with a groove, a step is arranged on one side of the lower surface of the groove, the R-type single-group laser and the L-type single-group laser are arranged at the two ends of the upper surface of the step respectively, the polarization beam combiner is arranged on the lower surface of the groove in front of the step, and the optical fiber coupler is arranged on the shell on the other side of the lower surface of the groove. According to the invention, a problem of mutual interference possibly occurring in space beam combination of the high-power single-group laser is avoided, the light source quality is obviously improved, and meanwhile, the problem of non-uniform heat dissipation of the high-power single-group laser is avoided.

Description

technical field [0001] The invention relates to a packaging structure and method of a high-power fiber-coupled semiconductor laser with multiple sets of symmetrical arrays, and belongs to the technical field of semiconductor laser packaging. Background technique [0002] After decades of development, semiconductor lasers have become more and more well-known to the society and have been applied in many fields. The photoelectric conversion efficiency of semiconductor lasers is above 60%, which is much higher than that of other similar products. The advantages of low energy consumption, less heat accumulation in the device, long life, good collimation, and long lighting distance are more and more widely used as an emerging technology in similar industries in society. The various advantages of semiconductor lasers determine that they are more and more widely valued by all walks of life. At present, the common ones on the market are mainly single-group high-power fiber-coupled s...

Claims

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Application Information

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IPC IPC(8): H01S5/40H01S5/0232H01S5/0225H01S5/024
CPCH01S5/02469H01S5/4025
Inventor 王宝立徐现刚郑兆河开北超
Owner Shandong Huaguang Optoelectronics Co. Ltd.
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