Processing method of PI reinforcement with mark line and manufacturing method of flexible circuit board

Abstract

The invention discloses a processing method of a PI reinforcement with a marking line and a manufacturing method of a flexible circuit board. According to the invention, the marking line on the PI reinforcement and a character on a product are separately silk-printed, the marking line is silk-printed on the whole board of the PI reinforcement, and then the subsequent processing is performed, when the marking line is silk-printed on the whole board of the PI reinforcement, the surface of the PI reinforcement board is flat and easy to silk-screen, and when the PI reinforcement is molded, a camera is adopted to identify the marking line on the PI reinforcement, and the PI reinforcement is processed and formed, so that the position precision of the marking line on the reinforcement can be improved; and the characters are subjected to silk-screen printing on the substrate which is not attached with the PI reinforcement, the surface of the substrate is flat, silk-screen printing is easy, and the silk-screen printing precision of the characters can be improved.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a PI reinforcement processing method with marking lines and a flexible circuit board production method. Background technique [0002] When flexible circuit boards and connectors and other components are plugged and installed, it is necessary to attach PI reinforcements to the back of the plug-in fingers of the flexible circuit boards, and silk screen marking lines on the PI reinforcements to facilitate plugging and installation in place, such as in PI White ink silk screen marking lines are used for reinforcement, and the existing manufacturing method of PI reinforced flexible circuit boards with marking lines, such as figure 1 As shown, PI reinforcement material preparation → PI reinforcement bottom surface glue preparation → PI reinforcement slitting, and then use the edge punching and sticking type automatic reinforcement machine to attach it to the substrate,...

AI Technical Summary

Problems solved by technology

[0002] When flexible circuit boards and connectors and other components are plugged and installed, it is necessary to attach PI reinforcements to the back of the plug-in fingers of the flexible circuit boards, and silk screen marking lines on the PI reinforcements to facilitate plugging and installation in place, such as in PI White ink silk screen marking lines are used for reinforcement, and the existing manufacturing method of PI reinforced flexible circuit boards with marking lines, such as figure 1 As shown, PI reinforcement material preparation → PI reinforcement bottom surface glue preparation → PI reinforcement slitting, and then use the edge punching and sticking type automatic reinforcement machine to attach it to the substrate, press and bake it on the substrate, and then print on the silk screen. During the manufacturing process, the characters and marking lines are screen-printed on the substrate together. Because the substrate is bonded with PI reinforcement, the heights of different areas on the substrate vary.

In addition, due to the relatively smooth surface of the PI reinforcement and the characteristics of the ink, the marking line on the PI reinforcement is easy to fall off during the subsequent processing, resulting in poor product quality and high defect rate

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