Multi-parameter detection optical-mechanical-electrical calculation and control integrated method for multi-section MEMS probe

Abstract

The invention discloses a multi-parameter detection opto-electro-mechanical calculation and control integrated method for a multi-section MEMS probe, and belongs to the technical field of precision testing and metering, micro-electro-mechanical systems, IC chip testing and probe cards. The method comprises the following steps: firstly opening an upper reference table and a loading table, then adjusting an objective table, scanning a tested piece, then establishing an array, processing an image, judging the type of the tested piece, and finally extracting time key parameters and calculating size key parameters. As a key technology in the MEMS probe structure and the testing method for chip testing in the ultra-high-temperature working environment, effective contact between the bare chip and the probe can be ensured in the ultra-high-temperature working environment in the large-size or multi-testing-point chip testing process, and then testing of the chip is facilitated.

Description

technical field [0001] The invention relates to a multi-parameter detection optical-mechanical-electronic calculation-control integration method for multi-section MEMS probes, which belongs to the technical fields of precision measurement, micro-electro-mechanical systems, IC chip testing and probe cards. Background technique [0002] A probe card is a device used to test bare die. The performance of the chip is tested by touching the probe to the pad or contact of the bare core to form an electrical connection, and by writing a test program to the chip. [0003] A key technology to realize the test is that the probes must all touch the pads or contacts of the bare core, which puts forward very high requirements on whether the ends of all probes are on the same plane. In this application, the degree to which the probe ends are in the same plane is defined as probe flatness. For a probe card with a small size and a small number of probes, it is easier to control the flatnes...

AI Technical Summary

Problems solved by technology

[0006] This kind of probe card with guide plate combination structure can realize the bare core test work under most working conditions, however, there are still some bare core test tasks that cannot be completed for the following reasons: In order to make the test real and effective, we need to ensure that the bare core The test environment is consistent with the working environment of the chip. Different chips have different working temperatures. Some chips work in a high temperature environment of about 100 degrees Celsius, while some chips work in an ultra-high temperature environment of 200 degrees Celsius.

For those chips that work in an ultra-high temperature environment, we also need to complete the test in the same temperature environment. Due to the limitation of the probe material, the probe will lose its elasticity in such an ultra-high temperature environment. If you insist on using structures such as intermediate guides or If the method is used to bend the probe, it will cause the probe to be plastically deformed and unable to rebound, not only cannot complete the test work of the bare core, but also will damage the probe card in severe cases

[0007] It can be seen that referring to the solution provided by the invention patent "Probe Device for Vertical Probe Card", although it can be applied to the testing work of most bare cores, it still cannot ensure large size or Effective contact between die and probe during multi-test point chip testing

Images