New energy automobile controller integration device based on V-shaped groove heat dissipation

Abstract

The invention discloses a new energy automobile controller integration device based on V-shaped groove heat dissipation. The device comprises a V-shaped groove radiator, a phase change film, a PCB base plate, a bakelite pressing block, a power capacitor plate, a wiring copper plate, an MOS tube, a connecting hole, a wiring copper nose, a first screw, an insulating particle, a second screw, an insulating sheet, a screw assembly hole, a control panel and a cover plate. A phase change film is distributed and connected to the outer wall of the top end of the V-shaped groove radiator in an attached mode, and the PCB base plate is connected to the outer wall of the top end, located on one side of the phase change film, of the V-shaped groove radiator in a clamped mode. According to the new energy automobile controller integration device, the MOS tube is not in contact with the PCB except for the pin so that the influence of MOS heat on other elements is effectively eliminated; and a tiled arrangement scheme is adopted so that the required PCB area is reduced, the cost is decreased, a ventilation quantity is increased, heat dissipation is facilitated, the transverse length of the radiator is reduced, and the size is convenient to simplify. Therefore, the controller is high in integration level and strong in integration.

Description

technical field [0001] The invention relates to the technical field of automobile controller integration equipment, in particular to a new energy automobile controller integration device based on V-shaped groove heat dissipation. Background technique [0002] With the shortage of energy, human beings urgently need to find new energy to replace fuel. The most effective way to reduce fuel consumption is to develop and promote new energy vehicles, in response to the call of the country's environmental protection, energy conservation and emission reduction policies; the design of automotive electronic products cannot avoid One of the problems is the heat dissipation design. A good heat dissipation structure can not only ensure the stable operation of the product and improve the product life, but also make the product maintain an elegant appearance, reduce the volume, and save material costs; [0003] The high-power MOS tube inside the new energy vehicle controller is a component...

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Problems solved by technology

[0003] The high-power MOS tube inside the new energy vehicle controller is a component that generates a relatively large amount of heat. How to ensure that the heat is dissipated to the maximum extent under the condition that the product functions are intact is a design link worth thinking about; currently, the industry generally adopts The best solution is to tile the MOS on the radiator. This conventional solution does not reduce the tile area of ​​the PCB board, which is not conducive to cost control, and the heat directly acts on the PCB board, which may affect the performance of other components. It is also a test for the Tg value of the PCB board; if the MOS tube does not adopt the plan of flat pressing, then the assembly method is a relatively difficult design point

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